824-AG30D-ES TE Connectivity
| Anzahl | Preis |
|---|---|
| 25+ | 5.94 EUR |
| 100+ | 5.63 EUR |
| 200+ | 5.31 EUR |
| 360+ | 5.01 EUR |
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Technische Details 824-AG30D-ES TE Connectivity
Description: CONN IC DIP SOCKET 24POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm).
Weitere Produktangebote 824-AG30D-ES
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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824-AG30D-ES | Hersteller : TE Connectivity |
 IC & Component Sockets 824-AG30D-ES SOCKET ASSY |
auf Bestellung 586 Stücke: Lieferzeit 10-14 Tag (e) |
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824-AG30D-ES | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |