832-AG11D TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Material - Post: Copper Alloy
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produktrezensionen
Produktbewertung abgeben
Technische Details 832-AG11D TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 32POS GOLD, Contact Material - Post: Copper Alloy, Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote 832-AG11D
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
832-AG11D | TE Connectivity / AMP |
IC & Component Sockets DIP-32 IC SOCKET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 832-AG11D |
|
Hersteller: TE Connectivity / AMP
IC & Component Sockets DIP-32 IC SOCKET
IC & Component Sockets DIP-32 IC SOCKET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH