832-AG11D TE Connectivity
| Anzahl | Privatkunde |
|---|---|
| 23+ | 7.65 EUR |
| 90+ | 7.4 EUR |
| 210+ | 7.1 EUR |
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Technische Details 832-AG11D TE Connectivity
Description: CONN IC DIP SOCKET 32POS GOLD, Contact Material - Post: Copper Alloy, Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote 832-AG11D
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
832-AG11D | TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 32POS GOLDContact Material - Post: Copper Alloy Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
832-AG11D | TE Connectivity / AMP |
IC & Component Sockets DIP-32 IC SOCKET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 832-AG11D |
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Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Material - Post: Copper Alloy
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Material - Post: Copper Alloy
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 832-AG11D |
![]() |
Hersteller: TE Connectivity / AMP
IC & Component Sockets DIP-32 IC SOCKET
IC & Component Sockets DIP-32 IC SOCKET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH




