Technische Details A22-LC-TT Assmann WSW Components
Description: IC-SOCKETS, Packaging: Bulk, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Termination: Solder, Number of Positions or Pins (Grid): 22 (2 x 11), Operating Temperature: -55°C ~ 85°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Contact Material - Post: Phosphor Bronze, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish - Mating: Tin.
Weitere Produktangebote A22-LC-TT
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| A22-LC-TT | Assmann WSW Components |
 Description: IC SOCKET 22POS .300 SPACING |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |
| A 22-LC-TT | Assmann WSW Components |
Description: IC-SOCKETS Packaging: Bulk Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT) Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 85°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| A22-LC-TT |
|
Hersteller: Assmann WSW Components
Description: IC SOCKET 22POS .300 SPACING
Description: IC SOCKET 22POS .300 SPACING
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A 22-LC-TT |
Hersteller: Assmann WSW Components
Description: IC-SOCKETS
Packaging: Bulk
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT)
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 85°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Description: IC-SOCKETS
Packaging: Bulk
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT)
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 85°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH