Technische Details A22-LC-TT Assmann WSW Components
Description: IC-SOCKETS, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 85°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Phosphor Bronze.
Weitere Produktangebote A22-LC-TT
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| A22-LC-TT | Assmann WSW Components |
 Description: IC SOCKET 22POS .300 SPACING |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | |
| A 22-LC-TT | Assmann WSW Components |
Description: IC-SOCKETS Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 85°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH |
| A22-LC-TT |
|
Hersteller: Assmann WSW Components
Description: IC SOCKET 22POS .300 SPACING
Description: IC SOCKET 22POS .300 SPACING
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| A 22-LC-TT |
Hersteller: Assmann WSW Components
Description: IC-SOCKETS
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 85°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Description: IC-SOCKETS
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 85°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
Stück im Wert von UAH