Technische Details DC1206-S Chip Quik Inc.
Description: DISCRETE 1206 TO 300MIL TH ADAPT, Packaging: Bulk, Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm), Material: FR4 Epoxy Glass, Number of Positions: 2, Pitch: 0.122" (3.10mm), Board Thickness: 0.031" (0.79mm) 1/32", Proto Board Type: SMD to SIP, Package Accepted: 1206.
Weitere Produktangebote DC1206-S
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DC1206S | Hersteller : Chip Quik Inc. |
Description: DISCRETE 1206 TO 300MIL TH ADAPT Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 2 Pitch: 0.122" (3.10mm) Board Thickness: 0.031" (0.79mm) 1/32" Proto Board Type: SMD to SIP Package Accepted: 1206 |
Produkt ist nicht verfügbar |