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Technische Details DILB18P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 18POS TINLEAD, Part Status: Active, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote DILB18P-223TLF nach Preis ab 0.58 EUR bis 1.02 EUR
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DILB18P-223TLF | Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 18POS TINLEADPart Status: Active Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 9283 Stücke: Lieferzeit 10-14 Tag (e) |
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| DILB18P-223TLF |
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Hersteller: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 18POS TINLEAD
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 18POS TINLEAD
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 9283 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 18+ | 1.02 EUR |
| 21+ | 0.86 EUR |
| 26+ | 0.8 EUR |
| 52+ | 0.76 EUR |
| 104+ | 0.73 EUR |
| 260+ | 0.68 EUR |
| 520+ | 0.65 EUR |
| 1014+ | 0.62 EUR |
| 2522+ | 0.58 EUR |