LPC1112FHI33/202,5 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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Technische Details LPC1112FHI33/202,5 NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN, Number of I/O: 28, Part Status: Active, Supplier Device Package: 32-HVQFN (5x5), Peripherals: Brown-out Detect/Reset, POR, WDT, Connectivity: I²C, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit Single-Core, Data Converters: A/D 8x10b, Core Processor: ARM® Cortex®-M0, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 4K x 8, Program Memory Size: 16KB (16K x 8), Speed: 50MHz, Mounting Type: Surface Mount, Package / Case: 32-VFQFN Exposed Pad, Packaging: Tray.
Weitere Produktangebote LPC1112FHI33/202,5
| Foto | Bezeichnung | Hersteller | Beschreibung |
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LPC1112FHI33/202,5 | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU CortexM0 32bit 16KB up to 4 kB SRAM |
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