LPC1113FHN33/203,5 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 275 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 167+ | 3.02 EUR |
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Technische Details LPC1113FHN33/203,5 NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN, Packaging: Bulk, Package / Case: 32-VQFN Exposed Pad, Mounting Type: Surface Mount, Speed: 50MHz, Program Memory Size: 24KB (24K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M0, Data Converters: A/D 8x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I2C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, WDT, Supplier Device Package: 32-HVQFN (7x7), Number of I/O: 28, DigiKey Programmable: Not Verified.
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LPC1113FHN33/203,5 | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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