LPC1812JET100E NXP Semiconductors
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.61 EUR |
| 10+ | 21.82 EUR |
| 25+ | 20.37 EUR |
| 100+ | 18.79 EUR |
| 260+ | 17.28 EUR |
| 520+ | 17.26 EUR |
| 1040+ | 17.06 EUR |
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Technische Details LPC1812JET100E NXP Semiconductors
Description: IC MCU 32BIT 512KB FLSH 100TFBGA, Number of I/O: 49, Part Status: Active, Supplier Device Package: 100-TFBGA (9x9), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT, Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 4x10b; D/A 1x10b, Core Processor: ARM® Cortex®-M3, EEPROM Size: 16K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Program Memory Size: 512KB (512K x 8), Speed: 180MHz, Mounting Type: Surface Mount, Package / Case: 100-TFBGA, Packaging: Tray, DigiKey Programmable: Not Verified, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 104K x 8.
Weitere Produktangebote LPC1812JET100E nach Preis ab 20.98 EUR bis 30.7 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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LPC1812JET100E | NXP USA Inc. |
 Description: IC MCU 32BIT 512KB FLSH 100TFBGANumber of I/O: 49 Part Status: Active Supplier Device Package: 100-TFBGA (9x9) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 4x10b; D/A 1x10b Core Processor: ARM® Cortex®-M3 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Program Memory Size: 512KB (512K x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 100-TFBGA Packaging: Tray DigiKey Programmable: Not Verified Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 104K x 8 |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC1812JET100E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.7 EUR |
| 10+ | 24.32 EUR |
| 25+ | 22.73 EUR |
| 100+ | 20.98 EUR |