LPC1822JET100E NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 26.07 EUR |
| 10+ | 20.83 EUR |
| 80+ | 17.6 EUR |
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Technische Details LPC1822JET100E NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA, Packaging: Tray, Package / Case: 100-TFBGA, Mounting Type: Surface Mount, Speed: 180MHz, Program Memory Size: 512KB (512K x 8), RAM Size: 104K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 16K x 8, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 4x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT, Supplier Device Package: 100-TFBGA (9x9), Number of I/O: 49, DigiKey Programmable: Not Verified.
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