Technische Details LPC18S10FET180E NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 180TFBGA, DigiKey Programmable: Not Verified, Number of I/O: 49, Supplier Device Package: 180-TFBGA (12x12), Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT, Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit Single-Core, Data Converters: A/D 4x10b; D/A 1x10b, Core Processor: ARM® Cortex®-M3, Program Memory Type: ROMless, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 136K x 8, Speed: 180MHz, Mounting Type: Surface Mount, Package / Case: 180-TFBGA, Packaging: Tray.
Weitere Produktangebote LPC18S10FET180E
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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LPC18S10FET180E | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA DigiKey Programmable: Not Verified Number of I/O: 49 Supplier Device Package: 180-TFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 4x10b; D/A 1x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 136K x 8 Speed: 180MHz Mounting Type: Surface Mount Package / Case: 180-TFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 189 Stücke Im Einkaufswagen Stück im Wert von UAH |
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LPC18S10FET180E | NXP Semiconductors | ARM Microcontrollers - MCU ARM Cortex M3 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 189 Stücke Im Einkaufswagen Stück im Wert von UAH |
| LPC18S10FET180E |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 189 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC18S10FET180E |
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU ARM Cortex M3
ARM Microcontrollers - MCU ARM Cortex M3
Produkt ist nicht verfügbar
Mindestbestellmenge: 189 Stücke
Im Einkaufswagen
Stück im Wert von UAH