Technische Details LPC2214FBD144,551 NXP
Description: IC MCU 16/32B 256KB FLSH 144LQFP, Packaging: Bag, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 60MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 16K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM7®, Data Converters: A/D 8x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Part Status: Obsolete, Number of I/O: 112, DigiKey Programmable: Not Verified.
Weitere Produktangebote LPC2214FBD144,551
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LPC2214FBD144,551 | Hersteller : NXP USA Inc. |
 Description: IC MCU 16/32B 256KB FLSH 144LQFPPackaging: Bag Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 112 DigiKey Programmable: Not Verified |
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