LPC3143FET180,551 NXP USA Inc.

Description: IC MCU 16/32BIT ROMLESS 180TFBGA, Number of I/O: 20, Part Status: Obsolete, Supplier Device Package: 180-TFBGA (12x12), Peripherals: DMA, I2S, LCD, PWM, WDT, Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG, Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V, Core Size: 16/32-Bit, Data Converters: A/D 4x10b, Core Processor: ARM926EJ-S, Program Memory Type: ROMless, Oscillator Type: External, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 192K x 8, Speed: 270MHz, Mounting Type: Surface Mount, Package / Case: 180-TFBGA, Packaging: Tray, DigiKey Programmable: Not Verified.