LPC5512JBD100E NXP Semiconductors
| Anzahl | Preis |
|---|---|
| 1+ | 11 EUR |
| 10+ | 8.57 EUR |
| 90+ | 7.04 EUR |
| 270+ | 6.9 EUR |
| 540+ | 5.68 EUR |
| 1080+ | 5.4 EUR |
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Technische Details LPC5512JBD100E NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 100HLQFP, Packaging: Tray, Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 64KB (64K x 8), RAM Size: 48K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 100-HLQFP (14x14), Part Status: Active, Number of I/O: 64, DigiKey Programmable: Not Verified.
Weitere Produktangebote LPC5512JBD100E
| Foto | Bezeichnung | Hersteller | Beschreibung |
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LPC5512JBD100E | Hersteller : NXP USA Inc. |
 Description: IC MCU 32BIT 64KB FLASH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
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