LPC5512JBD100K NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
| Anzahl | Preis |
|---|---|
| 3+ | 7.85 EUR |
| 10+ | 5.98 EUR |
| 25+ | 5.52 EUR |
| 100+ | 5.01 EUR |
| 450+ | 4.42 EUR |
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Technische Details LPC5512JBD100K NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP, Number of I/O: 64, Supplier Device Package: 100-HLQFP (14x14), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 10x16b SAR, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 48K x 8, Program Memory Size: 64KB (64K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 100-LQFP Exposed Pad, Packaging: Tray.
Weitere Produktangebote LPC5512JBD100K
| Foto | Bezeichnung | Hersteller | Beschreibung |
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LPC5512JBD100K | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC5512JBD100 |
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