LPC5526JBD100Y NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 993 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.4 EUR |
| 10+ | 8.02 EUR |
| 25+ | 7.42 EUR |
| 100+ | 6.76 EUR |
| 250+ | 6.46 EUR |
| 500+ | 6.26 EUR |
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Technische Details LPC5526JBD100Y NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP, Packaging: Tape & Reel (TR), Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 144K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 100-HLQFP (14x14), Number of I/O: 64.
Weitere Produktangebote LPC5526JBD100Y
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LPC5526JBD100Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
Produkt ist nicht verfügbar |
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LPC5526JBD100Y | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC5526JBD100 |
Produkt ist nicht verfügbar |