LPC5536JBD64E NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
| Anzahl | Preis |
|---|---|
| 2+ | 12.25 EUR |
| 10+ | 8.92 EUR |
| 25+ | 8.47 EUR |
| 160+ | 7.18 EUR |
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Technische Details LPC5536JBD64E NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP, DigiKey Programmable: Not Verified, Number of I/O: 39, Part Status: Active, Supplier Device Package: 64-HTQFP (10x10), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 13x16b; D/A 1x12b, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 128K x 8, Program Memory Size: 256KB (256K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Packaging: Tray.
Weitere Produktangebote LPC5536JBD64E nach Preis ab 7.41 EUR bis 12.57 EUR
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LPC5536JBD64E | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU Arm Cortex-M33-based Microcontroller with 8KB Cache |
auf Bestellung 321 Stücke: Lieferzeit 10-14 Tag (e) |
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