LPC55S66JBD64K NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
| Anzahl | Preis |
|---|---|
| 2+ | 10.65 EUR |
| 10+ | 8.2 EUR |
| 25+ | 7.59 EUR |
| 100+ | 6.91 EUR |
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Technische Details LPC55S66JBD64K NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP, Packaging: Tray, Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 144K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Part Status: Active, Number of I/O: 36, DigiKey Programmable: Not Verified.
Weitere Produktangebote LPC55S66JBD64K nach Preis ab 6.21 EUR bis 10.77 EUR
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LPC55S66JBD64K | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S66JBD64 |
auf Bestellung 330 Stücke: Lieferzeit 10-14 Tag (e) |
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