MC33FS6521CAE NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore CAN FS1B, LQFP48EP
| Anzahl | Preis |
|---|---|
| 1+ | 17.23 EUR |
| 10+ | 13.39 EUR |
| 25+ | 12.78 EUR |
| 100+ | 11.09 EUR |
| 250+ | 9.75 EUR |
| 500+ | 8.91 EUR |
| 1000+ | 8.47 EUR |
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Technische Details MC33FS6521CAE NXP Semiconductors
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO, Mounting Type: Surface Mount, Package / Case: 48-LQFP Exposed Pad, Packaging: Tray, Supplier Device Package: 48-HLQFP (7x7), Applications: System Basis Chip, Voltage - Supply: 1V ~ 5V, Operating Temperature: -40°C ~ 125°C.
Weitere Produktangebote MC33FS6521CAE
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
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MC33FS6521CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MC33FS6521CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH