MC33FS6522CAE NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore LDT CAN, LQFP48EP
| Anzahl | Preis |
|---|---|
| 1+ | 12.14 EUR |
| 10+ | 10.49 EUR |
| 25+ | 10.07 EUR |
| 100+ | 9.61 EUR |
| 250+ | 9.35 EUR |
| 500+ | 9.19 EUR |
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Technische Details MC33FS6522CAE NXP Semiconductors
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO, Packaging: Tray, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 1V ~ 5V, Applications: System Basis Chip, Supplier Device Package: 48-HLQFP (7x7).
Weitere Produktangebote MC33FS6522CAE
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
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MC33FS6522CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MC33FS6522CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH