MC33FS6523CAE NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore FS1B LDT CAN, LQFP48EP
| Anzahl | Privatkunde |
|---|---|
| 1+ | 19.37 EUR |
| 10+ | 15.12 EUR |
| 25+ | 14.08 EUR |
| 100+ | 12.92 EUR |
| 250+ | 12.38 EUR |
| 500+ | 12.02 EUR |
| 1000+ | 11.77 EUR |
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Technische Details MC33FS6523CAE NXP Semiconductors
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO, Packaging: Tray, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 1V ~ 5V, Applications: System Basis Chip, Supplier Device Package: 48-HLQFP (7x7).
Weitere Produktangebote MC33FS6523CAE nach Preis ab 16.12 EUR bis 23.94 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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MC33FS6523CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
auf Bestellung 199 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33FS6523CAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 199 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.94 EUR |
| 10+ | 18.81 EUR |
| 25+ | 17.53 EUR |
| 100+ | 16.12 EUR |