MC33PF8200DFES NXP USA Inc.
Hersteller: NXP USA Inc.
Description: I.MX8QXP WITH DDR3L
Packaging: Tray
Supplier Device Package: 56-HVQFN (8x8)
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
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Technische Details MC33PF8200DFES NXP USA Inc.
Description: I.MX8QXP WITH DDR3L, Packaging: Tray, Supplier Device Package: 56-HVQFN (8x8), Applications: High Performance i.MX 8, S32x Processor Based, Voltage - Supply: 2.5V ~ 5.5V, Operating Temperature: -40°C ~ 105°C (TA), Mounting Type: Surface Mount, Wettable Flank, Package / Case: 56-VFQFN Exposed Pad.
Weitere Produktangebote MC33PF8200DFES
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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MC33PF8200DFES | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, ASIL-B, Auto, QFN 56 |
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