MC33PF8200DFESR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 56-HVQFN (8x8)
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
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Technische Details MC33PF8200DFESR2 NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR, Mounting Type: Surface Mount, Wettable Flank, Package / Case: 56-VFQFN Exposed Pad, Packaging: Tape & Reel (TR), Supplier Device Package: 56-HVQFN (8x8), Applications: High Performance i.MX 8, S32x Processor Based, Voltage - Supply: 2.5V ~ 5.5V, Operating Temperature: -40°C ~ 105°C (TA).
Weitere Produktangebote MC33PF8200DFESR2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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MC33PF8200DFESR2 | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, ASIL-B, Auto, QFN 56 |
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