MC9S08QG8CFKE NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 16099 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 118+ | 4.05 EUR |
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Technische Details MC9S08QG8CFKE NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 24QFN, Packaging: Tray, Package / Case: 24-VFQFN Exposed Pad, Mounting Type: Surface Mount, Speed: 20MHz, Program Memory Size: 8KB (8K x 8), RAM Size: 512 x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: S08, Data Converters: A/D 8x10b, Core Size: 8-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I2C, SCI, SPI, Peripherals: LVD, POR, PWM, WDT, Supplier Device Package: 24-QFN-EP (4x4), Part Status: Active, Number of I/O: 12, DigiKey Programmable: Not Verified.
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MC9S08QG8CFKE | Hersteller : NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 24QFN Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN-EP (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
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