MCF54452VR266 NXP Semiconductors
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Technische Details MCF54452VR266 NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 360TEPBGA, Packaging: Tray, Package / Case: 360-BBGA, Mounting Type: Surface Mount, Speed: 266MHz, RAM Size: 32K x 8, Operating Temperature: 0°C ~ 70°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: Coldfire V4, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V, Connectivity: I2C, SPI, SSI, UART/USART, USB OTG, Peripherals: DMA, WDT, Supplier Device Package: 360-TEPBGA (23x23), Number of I/O: 132, DigiKey Programmable: Not Verified.
Weitere Produktangebote MCF54452VR266
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auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF54452VR266 | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
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