Technische Details MCF54453CVR200 NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 360TEPBGA, Packaging: Tray, Package / Case: 360-BBGA, Mounting Type: Surface Mount, Speed: 200MHz, RAM Size: 32K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: Coldfire V4, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V, Connectivity: I2C, SPI, SSI, UART/USART, USB OTG, Peripherals: DMA, WDT, Supplier Device Package: 360-TEPBGA (23x23), Part Status: Obsolete, Number of I/O: 132, DigiKey Programmable: Not Verified.
Weitere Produktangebote MCF54453CVR200
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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MCF54453CVR200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGAPackaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Part Status: Obsolete Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCF54453CVR200 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Part Status: Obsolete
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Part Status: Obsolete
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH



