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MCIMX233DJM4CR2

MCIMX233DJM4CR2 NXP USA Inc.


IMX233FS.pdf Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
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Technische Details MCIMX233DJM4CR2 NXP USA Inc.

Description: IC MPU I.MX23 454MHZ 169MAPBGA, Packaging: Tape & Reel (TR), Package / Case: 169-LFBGA, Mounting Type: Surface Mount, Speed: 454MHz, Operating Temperature: -10°C ~ 70°C (TA), Core Processor: ARM926EJ-S, Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V, Supplier Device Package: 169-MAPBGA (11x11), USB: USB 2.0 + PHY (1), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Data; DCP, RAM Controllers: DRAM, Graphics Acceleration: No, Display & Interface Controllers: LCD, Touchscreen, Security Features: Cryptography, Hardware ID.

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MCIMX233DJM4CR2 MCIMX233DJM4CR2 Hersteller : NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
MCIMX233DJM4CR2 MCIMX233DJM4CR2 Hersteller : NXP Semiconductors IMX23EC-3138222.pdf Microprocessors - MPU i.MX233 Commercial
Produkt ist nicht verfügbar