MCZ33905DS3EK NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32
| Anzahl | Privatkunde |
|---|---|
| 1+ | 17.59 EUR |
| 10+ | 13.2 EUR |
| 25+ | 11.73 EUR |
| 84+ | 9.73 EUR |
| 504+ | 9.48 EUR |
| 1008+ | 8.84 EUR |
| 2520+ | 8.69 EUR |
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Technische Details MCZ33905DS3EK NXP Semiconductors
Description: IC INTERFACE SPECIALIZED 32SOIC, Packaging: Tube, Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Mounting Type: Surface Mount, Interface: CAN, LIN, Voltage - Supply: 5.5V ~ 28V, Applications: System Basis Chip, Supplier Device Package: 32-SOIC-EP.
Weitere Produktangebote MCZ33905DS3EK
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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MCZ33905DS3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MCZ33905DS3EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
Mindestbestellmenge: 42 Stücke
Im Einkaufswagen
Stück im Wert von UAH