MFS8632BMBA0ES NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MFS8632BMBA0ES NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL, Packaging: Tray, Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 4.5V ~ 36V, Applications: Camera, Supplier Device Package: 48-QFN (7x7), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote MFS8632BMBA0ES
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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MFS8632BMBA0ES | Hersteller : NXP Semiconductors |
 Power Management Specialised - PMIC Safety System Basis Chip For Domain Controller, Fit For ASIL B |
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