MIMX8DX1FVOFZAC NXP USA Inc.
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Description: I.MX 8DUALXPLUS 17X17
Packaging: Tray
Package / Case: 417-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 417-FBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
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Technische Details MIMX8DX1FVOFZAC NXP USA Inc.
Description: I.MX 8DUALXPLUS 17X17, Packaging: Tray, Package / Case: 417-BFBGA, Mounting Type: Surface Mount, Speed: 1.2GHz, 264MHz, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F, Voltage - I/O: 1.8V, 2.5V, 3.3V, Supplier Device Package: 417-FBGA (17x17), Ethernet: 10/100/1000Mbps (2), USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1), Number of Cores/Bus Width: 3 Core, 64-Bit, Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP, RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM, Graphics Acceleration: Yes, Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI.
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| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| MIMX8DX1FVOFZAC | Hersteller : NXP Semiconductors | Processors - Application Specialised i.MX 8DualXPlus 17x17 |
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