MIMX8MN3CVPIZAA NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 32.96 EUR |
| 10+ | 26.52 EUR |
| 25+ | 24.91 EUR |
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Technische Details MIMX8MN3CVPIZAA NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA, Packaging: Tray, Package / Case: 306-TFBGA, Mounting Type: Surface Mount, Speed: 1.4GHz, Operating Temperature: -40°C ~ 105°C (TJ), Core Processor: ARM® Cortex®-A53, Supplier Device Package: 306-TFBGA (11x11), Ethernet: GbE, USB: USB 2.0 + PHY (2), Number of Cores/Bus Width: 2 Core, 64-Bit, Co-Processors/DSP: ARM® Cortex®-M7, RAM Controllers: DDR3L, DDR4, LPDDR4, Graphics Acceleration: Yes, Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI, Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS, Additional Interfaces: I2C, PCIe, SDHC, SPI, UART.
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