MIMX9312CVXXMAC NXP USA Inc.

Description: I.MX93 BGA9, Packaging: Tray, Package / Case: 208-VFBGA, Mounting Type: Surface Mount, Speed: 250MHz, 1.7GHz, Operating Temperature: -40°C ~ 105°C (TJ), Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33, Voltage - I/O: 1.8V, Supplier Device Package: 208-FCBGA (15x15), Ethernet: 10/100/1000Mbps (2), USB: USB 2.0 OTG (2), Number of Cores/Bus Width: 2, 1 Core, 64-Bit, Co-Processors/DSP: Multimedia; NEON™ MPE, RAM Controllers: LPDDR4, Graphics Acceleration: No, Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI, Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection, Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART.