Technische Details MPC860DEZQ66D4 MOT
Description: IC MPU MPC8XX 66MHZ 357BGA, Packaging: Tray, Package / Case: 357-BBGA, Mounting Type: Surface Mount, Speed: 66MHz, Operating Temperature: 0°C ~ 95°C (TA), Core Processor: MPC8xx, Voltage - I/O: 3.3V, Supplier Device Package: 357-PBGA (25x25), Ethernet: 10Mbps (2), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Communications; CPM, RAM Controllers: DRAM, Graphics Acceleration: No, Part Status: Obsolete.
Weitere Produktangebote MPC860DEZQ66D4
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| MPC860DEZQ66D4 | Hersteller : FRE |
 05+ |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC860DEZQ66D4 | Hersteller : NXP Semiconductors |
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 66MHz 357-Pin BGA Tray |
Produkt ist nicht verfügbar |
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MPC860DEZQ66D4 | Hersteller : NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |