OM13494UL NXP USA Inc.
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVQFN
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVQFN
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details OM13494UL NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION, Packaging: Bulk, Number of Positions: 16, 20, 24, Quantity: 24 Pieces (4 Values - 6 Each), Kit Type: Adapter, Breakout Boards, Specifications: SMD to DIP, Package Accepted: HVQFN.
Weitere Produktangebote OM13494UL
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
OM13494UL | Hersteller : NXP Semiconductors | Daughter Cards & OEM Boards Surface Mount to DIP Evaluation Board |
Produkt ist nicht verfügbar |