Technische Details OM13495UL NXP Semiconductors
Description: SURFACE MOUNT TO DIP EVALUATION, Packaging: Bulk, Number of Positions: 14, 16, 20, 24, Quantity: 24 Pieces (4 Values - 6 Each), Kit Type: Adapter, Breakout Boards, Specifications: SMD to DIP, Package Accepted: TSSOP.
Weitere Produktangebote OM13495UL
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
| OM13495UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATIONPackaging: Bulk Number of Positions: 14, 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| OM13495UL |
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Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: TSSOP
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH


