OM13497UL NXP USA Inc.
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 24
Quantity: 18 Pieces (3 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HTSSOP, VFBGA, XFBGA
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 24
Quantity: 18 Pieces (3 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HTSSOP, VFBGA, XFBGA
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Technische Details OM13497UL NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION, Packaging: Bulk, Number of Positions: 24, Quantity: 18 Pieces (3 Values - 6 Each), Kit Type: Adapter, Breakout Boards, Specifications: SMD to DIP, Package Accepted: HTSSOP, VFBGA, XFBGA.
Weitere Produktangebote OM13497UL
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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OM13497UL | Hersteller : NXP Semiconductors | Daughter Cards & OEM Boards Surface Mount to DIP Evaluation Board |
Produkt ist nicht verfügbar |