SPC5517GAMMG66
Hersteller: auf Bestellung 450 Stücke:
Lieferzeit 21-28 Tag (e)
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Technische Details SPC5517GAMMG66
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA, Packaging: Tray, Package / Case: 208-BGA, Mounting Type: Surface Mount, Speed: 66MHz, Program Memory Size: 1.5MB (1.5M x 8), RAM Size: 80K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: e200z0, e200z1, Data Converters: A/D 40x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V, Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 208-BGA (17x17), Number of I/O: 144, DigiKey Programmable: Not Verified.
Weitere Produktangebote SPC5517GAMMG66
| Foto | Bezeichnung | Hersteller | Beschreibung |
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SPC5517GAMMG66 | Hersteller : NXP Semiconductors |
MCU 32-bit e200z0/e200z1 RISC 1.5MB Flash 3.3V/5V Automotive 208-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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SPC5517GAMMG66 | Hersteller : NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 144 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |