SPC5775BSK3MME2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
Description: NXP 32-BIT MCU, 4MB FLASH FCACS
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR
Supplier Device Package: 416-MAPBGA (27x27)
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Technische Details SPC5775BSK3MME2 NXP USA Inc.
Description: NXP 32-BIT MCU, 4MB FLASH FCACS, Packaging: Tray, Package / Case: 416-BGA, Mounting Type: Surface Mount, Speed: 220MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 512K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Program Memory Type: FLASH, Core Processor: e200z7, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI, Peripherals: DMA, LVD, POR, Supplier Device Package: 416-MAPBGA (27x27).