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Technische Details TEA2209T/1Y NXP Semiconductors
Description: TEA2209T, Packaging: Tape & Reel (TR), Package / Case: 16-SOIC (0.154", 3.90mm Width), Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TJ), Voltage - Supply: 0.4 ~ 14V, Applications: Power Supplies, Current - Supply: 2mA, Supplier Device Package: 16-SO.
Weitere Produktangebote TEA2209T/1Y
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TEA2209T/1Y | Hersteller : NXP USA Inc. |
 Description: TEA2209TPackaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.4 ~ 14V Applications: Power Supplies Current - Supply: 2mA Supplier Device Package: 16-SO |
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