Technische Details UJA1169TK/F/3Z NXP Semiconductors
Description: IC INTFACE SPECIALIZED 20HVSON, Packaging: Tape & Reel (TR), Package / Case: 20-VFDFN Exposed Pad, Mounting Type: Surface Mount, Interface: CAN, Voltage - Supply: 5V, Applications: System Basis Chip, Supplier Device Package: 20-HVSON (3.5x5.5).
Weitere Produktangebote UJA1169TK/F/3Z
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
UJA1169TK/F/3Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 20HVSONPackaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| UJA1169TK/F/3Z |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC INTFACE SPECIALIZED 20HVSON
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH


