Produkte > WAKEFIELD THERMAL SOLUTIONS > Alle Produkte des Herstellers WAKEFIELD THERMAL SOLUTIONS (552) > Seite 10 nach 10
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WAVE-35-125 | Wakefield Thermal Solutions |
Description: ANCHOR HEATSINK 35X35X12.5MMPackaging: Bulk Material: Aluminum Alloy Length: 1.378" (35.00mm) Shape: Square, Angled Fins Type: Board Level Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Clip Thermal Resistance @ Forced Air Flow: 3.63°C/W @ 200 LFM Fin Height: 0.492" (12.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 794 Stücke: Lieferzeit 10-14 Tag (e) |
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WAVE-35-15 | Wakefield Thermal Solutions |
Description: ANCHOR HEATSINK 35X35X15MMPackaging: Bulk Material: Aluminum Alloy Length: 1.378" (35.00mm) Shape: Square, Angled Fins Type: Board Level Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Clip Thermal Resistance @ Forced Air Flow: 3.15°C/W @ 200 LFM Fin Height: 0.590" (15.00mm) Material Finish: Black Anodized |
auf Bestellung 965 Stücke: Lieferzeit 10-14 Tag (e) |
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WAVE-35-21 | Wakefield Thermal Solutions |
Description: ANCHOR HEATSINK 35X35X21MMPackaging: Bulk Material: Aluminum Alloy Length: 1.378" (35.00mm) Shape: Square, Angled Fins Type: Board Level Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Clip Thermal Resistance @ Forced Air Flow: 2.11°C/W @ 200 LFM Fin Height: 0.827" (21.00mm) Material Finish: Black Anodized |
auf Bestellung 735 Stücke: Lieferzeit 10-14 Tag (e) |
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WAVE-40-12 | Wakefield Thermal Solutions |
Description: ANCHOR HEATSINK 40X40X12MMPackaging: Bulk Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Angled Fins Type: Board Level Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Clip Thermal Resistance @ Forced Air Flow: 3.36°C/W @ 200 LFM Fin Height: 0.472" (12.00mm) Material Finish: Black Anodized |
auf Bestellung 189 Stücke: Lieferzeit 10-14 Tag (e) |
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WAVE-40-125 | Wakefield Thermal Solutions |
Description: ANCHOR HEATSINK 40X40X12.5MMPackaging: Bulk Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Angled Fins Type: Board Level Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Clip Thermal Resistance @ Forced Air Flow: 3.16°C/W @ 200 LFM Fin Height: 0.492" (12.50mm) Material Finish: Black Anodized |
auf Bestellung 494 Stücke: Lieferzeit 10-14 Tag (e) |
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WAVE-ANC2 | Wakefield Thermal Solutions |
Description: ASSEMBLY SOLDER ANCHORPackaging: Bulk For Use With/Related Products: BGA Heat Sinks Accessory Type: Solder Anchor (2 required) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| WTC5R1F0-0.69x0.56 | Wakefield Thermal Solutions |
Description: THERM PAD 17.45MMX14.27MM BLACKPackaging: Box Color: Black Material: Graphite Shape: Rectangle Thickness: 0.0050" (0.127mm) Type: Insulator Pad, Sheet Thermal Resistivity: 0.07°C/W Usage: TO-220 Outline: 17.53mm x 14.22mm Thermal Conductivity: 2.0W/m-K Backing, Carrier: Fiberglass |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| WTC5R1F0-0.75x0.50 | Wakefield Thermal Solutions |
Description: THERM PAD 19.05MMX12.7MM BLACKPackaging: Box Color: Gray Material: Graphite Shape: Rectangle Thickness: 0.0050" (0.127mm) Type: Insulator Pad, Sheet Thermal Resistivity: 0.07°C/W Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 2.0W/m-K Backing, Carrier: Fiberglass |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| WTC6R1A0-0.75x0.50 | Wakefield Thermal Solutions |
Description: THERM PAD 19.05MMX12.7MM BLACKPackaging: Box Color: Black Material: Graphite Shape: Rectangle Thickness: 0.0060" (0.152mm) Type: Insulator Pad, Sheet Thermal Resistivity: 0.07°C/W Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 2.5W/m-K Backing, Carrier: Aluminum |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| WTI6R1K0-0.75x0.50 | Wakefield Thermal Solutions |
Description: THERM PAD 19.05MMX12.7MM BEIGEPackaging: Box Color: Black Material: Graphite Shape: Rectangle Thickness: 0.0050" (0.127mm) Type: Insulator Pad, Sheet Thermal Resistivity: 0.07°C/W Usage: Power Module Outline: 19.05mm x 12.70mm Thermal Conductivity: 2.0W/m-K Backing, Carrier: Fiberglass |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| WTI9R1F1-0.75X0.50 | Wakefield Thermal Solutions |
Description: THERM PAD 19.05MMX12.7MM W/ADHPackaging: Box Color: Gray Material: Silicone Shape: Rectangle Thickness: 0.0090" (0.229mm) Type: Insulator Pad, Sheet Thermal Resistivity: 0.605°C/W Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 0.8W/m-K Adhesive: Adhesive - One Side Backing, Carrier: Fiberglass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| WAVE-35-125 |
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Hersteller: Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 35X35X12.5MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.378" (35.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.63°C/W @ 200 LFM
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Part Status: Active
Description: ANCHOR HEATSINK 35X35X12.5MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.378" (35.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.63°C/W @ 200 LFM
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 794 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.16 EUR |
| 10+ | 5.45 EUR |
| 25+ | 5.19 EUR |
| 50+ | 5 EUR |
| 100+ | 4.82 EUR |
| 250+ | 4.59 EUR |
| 500+ | 4.43 EUR |
| WAVE-35-15 |
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Hersteller: Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 35X35X15MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.378" (35.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.15°C/W @ 200 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Black Anodized
Description: ANCHOR HEATSINK 35X35X15MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.378" (35.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.15°C/W @ 200 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Black Anodized
auf Bestellung 965 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.6 EUR |
| 10+ | 5.85 EUR |
| 25+ | 5.58 EUR |
| 50+ | 5.38 EUR |
| 100+ | 5.18 EUR |
| 250+ | 4.93 EUR |
| 500+ | 4.76 EUR |
| WAVE-35-21 |
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Hersteller: Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 35X35X21MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.378" (35.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 2.11°C/W @ 200 LFM
Fin Height: 0.827" (21.00mm)
Material Finish: Black Anodized
Description: ANCHOR HEATSINK 35X35X21MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.378" (35.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 2.11°C/W @ 200 LFM
Fin Height: 0.827" (21.00mm)
Material Finish: Black Anodized
auf Bestellung 735 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.57 EUR |
| 10+ | 8.46 EUR |
| 25+ | 8.06 EUR |
| 50+ | 7.77 EUR |
| 100+ | 7.49 EUR |
| 250+ | 7.13 EUR |
| 500+ | 6.87 EUR |
| WAVE-40-12 |
![]() |
Hersteller: Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 40X40X12MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.36°C/W @ 200 LFM
Fin Height: 0.472" (12.00mm)
Material Finish: Black Anodized
Description: ANCHOR HEATSINK 40X40X12MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.36°C/W @ 200 LFM
Fin Height: 0.472" (12.00mm)
Material Finish: Black Anodized
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.57 EUR |
| 10+ | 6.7 EUR |
| 25+ | 6.38 EUR |
| 50+ | 6.15 EUR |
| 100+ | 5.93 EUR |
| WAVE-40-125 |
![]() |
Hersteller: Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 40X40X12.5MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.16°C/W @ 200 LFM
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Description: ANCHOR HEATSINK 40X40X12.5MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.16°C/W @ 200 LFM
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
auf Bestellung 494 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.37 EUR |
| 10+ | 6.53 EUR |
| 25+ | 6.22 EUR |
| 50+ | 5.99 EUR |
| 100+ | 5.78 EUR |
| 250+ | 5.5 EUR |
| WAVE-ANC2 |
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Hersteller: Wakefield Thermal Solutions
Description: ASSEMBLY SOLDER ANCHOR
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Description: ASSEMBLY SOLDER ANCHOR
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| WTC5R1F0-0.69x0.56 |
![]() |
Hersteller: Wakefield Thermal Solutions
Description: THERM PAD 17.45MMX14.27MM BLACK
Packaging: Box
Color: Black
Material: Graphite
Shape: Rectangle
Thickness: 0.0050" (0.127mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: TO-220
Outline: 17.53mm x 14.22mm
Thermal Conductivity: 2.0W/m-K
Backing, Carrier: Fiberglass
Description: THERM PAD 17.45MMX14.27MM BLACK
Packaging: Box
Color: Black
Material: Graphite
Shape: Rectangle
Thickness: 0.0050" (0.127mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: TO-220
Outline: 17.53mm x 14.22mm
Thermal Conductivity: 2.0W/m-K
Backing, Carrier: Fiberglass
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 17+ | 1.06 EUR |
| 20+ | 0.92 EUR |
| 25+ | 0.88 EUR |
| 50+ | 0.85 EUR |
| 100+ | 0.82 EUR |
| 250+ | 0.78 EUR |
| 500+ | 0.75 EUR |
| 1000+ | 0.72 EUR |
| 5000+ | 0.66 EUR |
| WTC5R1F0-0.75x0.50 |
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Hersteller: Wakefield Thermal Solutions
Description: THERM PAD 19.05MMX12.7MM BLACK
Packaging: Box
Color: Gray
Material: Graphite
Shape: Rectangle
Thickness: 0.0050" (0.127mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 2.0W/m-K
Backing, Carrier: Fiberglass
Description: THERM PAD 19.05MMX12.7MM BLACK
Packaging: Box
Color: Gray
Material: Graphite
Shape: Rectangle
Thickness: 0.0050" (0.127mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 2.0W/m-K
Backing, Carrier: Fiberglass
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 23+ | 0.79 EUR |
| 26+ | 0.7 EUR |
| 27+ | 0.66 EUR |
| 50+ | 0.64 EUR |
| 100+ | 0.62 EUR |
| 250+ | 0.59 EUR |
| 500+ | 0.57 EUR |
| 1000+ | 0.55 EUR |
| 5000+ | 0.5 EUR |
| WTC6R1A0-0.75x0.50 |
![]() |
Hersteller: Wakefield Thermal Solutions
Description: THERM PAD 19.05MMX12.7MM BLACK
Packaging: Box
Color: Black
Material: Graphite
Shape: Rectangle
Thickness: 0.0060" (0.152mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 2.5W/m-K
Backing, Carrier: Aluminum
Description: THERM PAD 19.05MMX12.7MM BLACK
Packaging: Box
Color: Black
Material: Graphite
Shape: Rectangle
Thickness: 0.0060" (0.152mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 2.5W/m-K
Backing, Carrier: Aluminum
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 23+ | 0.79 EUR |
| 26+ | 0.7 EUR |
| 27+ | 0.66 EUR |
| 50+ | 0.64 EUR |
| 100+ | 0.62 EUR |
| 250+ | 0.59 EUR |
| 500+ | 0.57 EUR |
| 1000+ | 0.55 EUR |
| 5000+ | 0.5 EUR |
| WTI6R1K0-0.75x0.50 |
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Hersteller: Wakefield Thermal Solutions
Description: THERM PAD 19.05MMX12.7MM BEIGE
Packaging: Box
Color: Black
Material: Graphite
Shape: Rectangle
Thickness: 0.0050" (0.127mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: Power Module
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 2.0W/m-K
Backing, Carrier: Fiberglass
Description: THERM PAD 19.05MMX12.7MM BEIGE
Packaging: Box
Color: Black
Material: Graphite
Shape: Rectangle
Thickness: 0.0050" (0.127mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.07°C/W
Usage: Power Module
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 2.0W/m-K
Backing, Carrier: Fiberglass
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 21+ | 0.84 EUR |
| 24+ | 0.75 EUR |
| 25+ | 0.72 EUR |
| 50+ | 0.69 EUR |
| 100+ | 0.67 EUR |
| 250+ | 0.64 EUR |
| 500+ | 0.61 EUR |
| 1000+ | 0.59 EUR |
| 5000+ | 0.54 EUR |
| WTI9R1F1-0.75X0.50 |
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Hersteller: Wakefield Thermal Solutions
Description: THERM PAD 19.05MMX12.7MM W/ADH
Packaging: Box
Color: Gray
Material: Silicone
Shape: Rectangle
Thickness: 0.0090" (0.229mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.605°C/W
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.8W/m-K
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
Description: THERM PAD 19.05MMX12.7MM W/ADH
Packaging: Box
Color: Gray
Material: Silicone
Shape: Rectangle
Thickness: 0.0090" (0.229mm)
Type: Insulator Pad, Sheet
Thermal Resistivity: 0.605°C/W
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.8W/m-K
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH

