Produkte > ADVANCED THERMAL SOLUTIONS INC. > Alle Produkte des Herstellers ADVANCED THERMAL SOLUTIONS INC. (110338) > Seite 1839 nach 1839
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ATS-09G-22-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 60X60X12.7MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.362" (60.00mm) Shape: Square, Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 13.83°C/W @ 100 LFM Fin Height: 0.500" (12.70mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-19E-157-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X30MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 3.35°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-09D-103-C2-R1 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X9.5MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 27.67°C/W @ 100 LFM Fin Height: 0.374" (9.50mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-01F-210-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 70X70X12MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.756" (70.00mm) Shape: Square, Fins Type: Top Mount Width: 2.756" (70.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.18°C/W @ 100 LFM Fin Height: 0.472" (12.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-15H-53-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X30MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 8.57°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-13A-175-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 13.52°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-11B-47-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X30MM L-TAB T766Packaging: Tray Material: Aluminum Length: 0.984" (25.00mm) Shape: Square, Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-HP-F8L300S21W-413 | Advanced Thermal Solutions Inc. |
Description: HEAT PIPE FLAT 4.2X10.6X300MMPackaging: Bulk Material: Copper Length: 11.811" (300.00mm) Shape: Flat Type: Heat Pipe Width: 0.417" (10.60mm) Operating Temperature: 30°C ~ 120°C Height: 0.165" (4.20mm) Attachment Method: Epoxy or Solder Wick Type: Sintered Power - Cooling: 26.0W @ 300mm |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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ATS-HP-F8L500S12W-417 | Advanced Thermal Solutions Inc. |
Description: HEAT PIPE FLAT 4.2X10.6X500MMPackaging: Bulk Material: Copper Length: 19.685" (500.00mm) Shape: Flat Type: Heat Pipe Width: 0.417" (10.60mm) Operating Temperature: 30°C ~ 120°C Height: 0.165" (4.20mm) Attachment Method: Epoxy or Solder Wick Type: Sintered Power - Cooling: 15.6W @ 500mm |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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ATS-02H-39-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 57.9X60.96X5.84MM T766Packaging: Bulk Material: Aluminum Length: 2.280" (57.90mm) Shape: Rectangular, Fins Type: Top Mount Width: 2.400" (60.96mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM Fin Height: 0.230" (5.84mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-03F-89-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X30MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.94°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-18F-79-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-05H-197-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X10MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-12C-144-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X25MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-15B-41-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 57.9X60.96X17.78MM T766Packaging: Bulk Material: Aluminum Length: 2.280" (57.90mm) Shape: Rectangular, Fins Type: Top Mount Width: 2.400" (60.96mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 10.03°C/W @ 100 LFM Fin Height: 0.700" (17.78mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-10-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X25MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-104-C2-R1 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X12.7MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 25.23°C/W @ 100 LFM Fin Height: 0.500" (12.70mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-103-C2-R1 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X9.5MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 27.67°C/W @ 100 LFM Fin Height: 0.374" (9.50mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-100-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X25MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 8.70°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-105-C2-R1 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45.00MM X 45.00MM ALUMPackaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 28.22°C/W @ 100 LFM Fin Height: 0.374" (9.50mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-107-C2-R1 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50.00MM X 50.00MM ALUMPackaging: Tray Material: Aluminum Length: 1.969" (50.00mm) Shape: Square, Fins Type: Top Mount Width: 1.969" (50.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 27.93°C/W @ 100 LFM Fin Height: 0.374" (9.50mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-106-C2-R1 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45.00MM X 45.00MM ALUMPackaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.60°C/W @ 100 LFM Fin Height: 0.500" (12.70mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-101-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X30MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08E-102-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X35MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.24°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-04G-79-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-06G-79-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-07G-49-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-07G-79-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-15G-71-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X30MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-18F-84-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X35MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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ATS-18E-115-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X20MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.33°C/W @ 100 LFM Fin Height: 0.790" (20.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-07H-131-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 60X60X20MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.362" (60.00mm) Shape: Square, Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM Fin Height: 0.790" (20.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-15D-65-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X30MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-19E-144-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X25MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-19E-15-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X25MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.969" (50.00mm) Shape: Square, Fins Type: Top Mount Width: 1.969" (50.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.44°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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ATS-14C-191-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X30MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-HP-F5L70S52W-215 | Advanced Thermal Solutions Inc. |
Description: HEAT PIPE FLAT 3X6.44X70MMPackaging: Bulk Material: Copper Length: 2.756" (70.00mm) Shape: Flat Type: Heat Pipe Width: 0.254" (6.44mm) Operating Temperature: 30°C ~ 120°C Height: 0.118" (3.00mm) Attachment Method: Epoxy or Solder Wick Type: Sintered |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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ATS-12A-204-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 54X54X12MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.126" (54.00mm) Shape: Square, Fins Type: Top Mount Width: 2.126" (54.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM Fin Height: 0.472" (12.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08G-49-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-09G-79-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-17F-26-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 70X70X10MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.756" (70.00mm) Shape: Square, Fins Type: Top Mount Width: 2.756" (70.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 14.20°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-TEC30-36-017 | Advanced Thermal Solutions Inc. |
Description: TEC MODULE, 30X30X3.6Packaging: Bulk Features: Lead Wires, Sealed - Silicone RTV Size / Dimension: Square - 30.00mm L x 30.00mm W Type: TEC (Thermoelectric Cooler) Height: 3.60mm Delta Tmax @ Th: 68°C @ 27°C Qmax @ Th: 26.7W @ 27°C Current - Max: 3 A Voltage - Max: 15.4 V Resistance: 3.42 Ohms Number of Stages: 1 |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-TEC30-44-082 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3mmPackaging: Box Features: Lead Wires Size / Dimension: Square - 30.00mm L x 30.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.00mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 45.5W @ 27°C Current - Max: 9 A Voltage - Max: 8.61 V Resistance: 750 mOhms Number of Stages: 1 |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-TEC30-64-086 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3.2mmPackaging: Box Features: Lead Wires Size / Dimension: Square - 30.00mm L x 30.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.20mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 65.7W @ 27°C Current - Max: 13 A Voltage - Max: 8.61 V Resistance: 520 mOhms Number of Stages: 1 |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-TEC30-74-084 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3.1mmPackaging: Box Features: Lead Wires Size / Dimension: Square - 30.00mm L x 30.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.10mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 75.9W @ 27°C Current - Max: 15 A Voltage - Max: 8.61 V Resistance: 450 mOhms Number of Stages: 1 |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-TEC30-59-085 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3.2mmPackaging: Box Features: Lead Wires Size / Dimension: Square - 30.00mm L x 30.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.20mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 60.7W @ 27°C Current - Max: 12 A Voltage - Max: 8.61 V Resistance: 560 mOhms Number of Stages: 1 |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-11D-96-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X35MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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| ATS-NVA2-3554-C3-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK JETSON ORIN NX NANO SUPPackaging: Box Material: Aluminum Alloy Length: 2.264" (57.50mm) Shape: Rectangular, Fins Type: Top Mount with Fan Width: 1.575" (40.00mm) Package Cooled: Nvidia Jetson, Orin NX Attachment Method: Bolt On, Thermal Material Thermal Resistance @ Forced Air Flow: 0.94°C/W @ 200 LFM Thermal Resistance @ Natural: 0.94°C/W Fin Height: 0.905" (23.00mm) Material Finish: Blue Anodized |
auf Bestellung 77 Stücke: Lieferzeit 10-14 Tag (e) |
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| ATS-NVP-3681-C1-R1 | Advanced Thermal Solutions Inc. |
Description: PLATE NVIDA TTP ORIN NANO/NXPackaging: Box Material: Aluminum Length: 2.480" (63.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Nvidia Jetson Orin Nano, Orin NX Attachment Method: Bolt On, Thermal Material Fin Height: 0.197" (5.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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ATS-10G-39-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 57.9X60.96X5.84MM T766Packaging: Bulk Material: Aluminum Length: 2.280" (57.90mm) Shape: Rectangular, Fins Type: Top Mount Width: 2.400" (60.96mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM Fin Height: 0.230" (5.84mm) Material Finish: Blue Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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ATS-16A-16-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 54X54X10MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.126" (54.00mm) Shape: Square, Fins Type: Top Mount Width: 2.126" (54.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-13F-13-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X15MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.969" (50.00mm) Shape: Square, Fins Type: Top Mount Width: 1.969" (50.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 13.70°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-13F-129-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 60X60X10MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.362" (60.00mm) Shape: Square, Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-02B-07-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X12.7MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 17.00°C/W @ 100 LFM Fin Height: 0.500" (12.70mm) Material Finish: Blue Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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ATS-TEC50-195-185 | Advanced Thermal Solutions Inc. |
Description: TEC Module 50x50x3.3mmPackaging: Box Features: Lead Wires Size / Dimension: Square - 50.00mm L x 50.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.30mm Delta Tmax @ Th: 68°C @ 27°C Qmax @ Th: 200.0W @ 27°C Current - Max: 20 A Voltage - Max: 15.4 V Resistance: 580 mOhms Number of Stages: 1 |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-08B-03-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X15MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 15.85°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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ATS-09D-73-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 0.984" (25.00mm) Shape: Square, Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 28.85°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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| ATS-HP-D6L150S71W-129 | Advanced Thermal Solutions Inc. |
Liquid Cold Plates, LiLiquid Cold Plates, Liquid Cooling & Heat Pipes Heat Pipe, Copper, High Performance, Round, 150mm, 6mm dia. |
auf Bestellung 49 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| ATS-09G-22-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.83°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Description: HEATSINK 60X60X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.83°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 12.41 EUR |
| 10+ | 10.97 EUR |
| 25+ | 10.45 EUR |
| ATS-19E-157-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 3.35°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 3.35°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.08 EUR |
| 10+ | 8.93 EUR |
| 25+ | 8.51 EUR |
| ATS-09D-103-C2-R1 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X9.5MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 27.67°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X9.5MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 27.67°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.49 EUR |
| 10+ | 9.28 EUR |
| 25+ | 8.84 EUR |
| ATS-01F-210-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 70X70X12MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.756" (70.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.756" (70.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.18°C/W @ 100 LFM
Fin Height: 0.472" (12.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 70X70X12MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.756" (70.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.756" (70.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.18°C/W @ 100 LFM
Fin Height: 0.472" (12.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.44 EUR |
| 10+ | 14.55 EUR |
| 25+ | 13.86 EUR |
| ATS-15H-53-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.57°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.57°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.4 EUR |
| 10+ | 8.31 EUR |
| 25+ | 7.91 EUR |
| ATS-13A-175-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.52°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 35X35X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.52°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.75 EUR |
| 10+ | 7.74 EUR |
| 25+ | 7.37 EUR |
| ATS-11B-47-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 25X25X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.66 EUR |
| 10+ | 7.66 EUR |
| 25+ | 7.3 EUR |
| ATS-HP-F8L300S21W-413 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEAT PIPE FLAT 4.2X10.6X300MM
Packaging: Bulk
Material: Copper
Length: 11.811" (300.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.417" (10.60mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.165" (4.20mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Power - Cooling: 26.0W @ 300mm
Description: HEAT PIPE FLAT 4.2X10.6X300MM
Packaging: Bulk
Material: Copper
Length: 11.811" (300.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.417" (10.60mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.165" (4.20mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Power - Cooling: 26.0W @ 300mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-HP-F8L500S12W-417 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEAT PIPE FLAT 4.2X10.6X500MM
Packaging: Bulk
Material: Copper
Length: 19.685" (500.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.417" (10.60mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.165" (4.20mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Power - Cooling: 15.6W @ 500mm
Description: HEAT PIPE FLAT 4.2X10.6X500MM
Packaging: Bulk
Material: Copper
Length: 19.685" (500.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.417" (10.60mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.165" (4.20mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Power - Cooling: 15.6W @ 500mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-02H-39-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 57.9X60.96X5.84MM T766
Packaging: Bulk
Material: Aluminum
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 2.400" (60.96mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM
Fin Height: 0.230" (5.84mm)
Material Finish: Blue Anodized
Description: HEATSINK 57.9X60.96X5.84MM T766
Packaging: Bulk
Material: Aluminum
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 2.400" (60.96mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM
Fin Height: 0.230" (5.84mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.76 EUR |
| 10+ | 12.17 EUR |
| 25+ | 11.6 EUR |
| ATS-03F-89-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.94°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 35X35X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.94°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.17 EUR |
| 10+ | 9.01 EUR |
| 25+ | 8.58 EUR |
| ATS-18F-79-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.04 EUR |
| 10+ | 7.13 EUR |
| 25+ | 6.79 EUR |
| ATS-05H-197-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.29 EUR |
| 10+ | 7.33 EUR |
| 25+ | 6.99 EUR |
| ATS-12C-144-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 8.82 EUR |
| 10+ | 7.8 EUR |
| 25+ | 7.43 EUR |
| ATS-15B-41-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 57.9X60.96X17.78MM T766
Packaging: Bulk
Material: Aluminum
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 2.400" (60.96mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.03°C/W @ 100 LFM
Fin Height: 0.700" (17.78mm)
Material Finish: Blue Anodized
Description: HEATSINK 57.9X60.96X17.78MM T766
Packaging: Bulk
Material: Aluminum
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 2.400" (60.96mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.03°C/W @ 100 LFM
Fin Height: 0.700" (17.78mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 15.08 EUR |
| 10+ | 13.36 EUR |
| 25+ | 12.72 EUR |
| ATS-08E-10-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X25MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X25MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.33 EUR |
| 10+ | 8.25 EUR |
| 25+ | 7.86 EUR |
| ATS-08E-104-C2-R1 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 25.23°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 25.23°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.45 EUR |
| 10+ | 9.25 EUR |
| 25+ | 8.81 EUR |
| ATS-08E-103-C2-R1 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X9.5MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 27.67°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X9.5MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 27.67°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.56 EUR |
| 10+ | 9.35 EUR |
| 25+ | 8.9 EUR |
| ATS-08E-100-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X25MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.70°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X25MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.70°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.96 EUR |
| 10+ | 9.71 EUR |
| 25+ | 9.25 EUR |
| ATS-08E-105-C2-R1 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45.00MM X 45.00MM ALUM
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 28.22°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
Description: HEATSINK 45.00MM X 45.00MM ALUM
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 28.22°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11 EUR |
| 10+ | 9.73 EUR |
| 25+ | 9.27 EUR |
| ATS-08E-107-C2-R1 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50.00MM X 50.00MM ALUM
Packaging: Tray
Material: Aluminum
Length: 1.969" (50.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.969" (50.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 27.93°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
Description: HEATSINK 50.00MM X 50.00MM ALUM
Packaging: Tray
Material: Aluminum
Length: 1.969" (50.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.969" (50.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 27.93°C/W @ 100 LFM
Fin Height: 0.374" (9.50mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.32 EUR |
| 10+ | 10.02 EUR |
| 25+ | 9.54 EUR |
| ATS-08E-106-C2-R1 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45.00MM X 45.00MM ALUM
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.60°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Description: HEATSINK 45.00MM X 45.00MM ALUM
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.60°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.4 EUR |
| 10+ | 10.09 EUR |
| 25+ | 9.61 EUR |
| ATS-08E-101-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.63 EUR |
| 10+ | 10.28 EUR |
| 25+ | 9.8 EUR |
| ATS-08E-102-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.24°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.24°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.97 EUR |
| 10+ | 10.6 EUR |
| 25+ | 10.09 EUR |
| ATS-04G-79-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.99 EUR |
| 10+ | 7.08 EUR |
| 25+ | 6.74 EUR |
| ATS-06G-79-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.04 EUR |
| 10+ | 7.13 EUR |
| 25+ | 6.79 EUR |
| ATS-07G-49-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.04 EUR |
| 10+ | 7.13 EUR |
| 25+ | 6.79 EUR |
| ATS-07G-79-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.04 EUR |
| 10+ | 7.13 EUR |
| 25+ | 6.79 EUR |
| ATS-15G-71-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.7 EUR |
| 10+ | 10.35 EUR |
| 25+ | 9.86 EUR |
| ATS-18F-84-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-18E-115-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X20MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.33°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X20MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.33°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.15 EUR |
| 10+ | 7.2 EUR |
| 25+ | 6.86 EUR |
| ATS-07H-131-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X20MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 60X60X20MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 12.2 EUR |
| 10+ | 10.79 EUR |
| 25+ | 10.28 EUR |
| ATS-15D-65-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.63 EUR |
| 10+ | 9.42 EUR |
| 25+ | 8.97 EUR |
| ATS-19E-144-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 8.8 EUR |
| 10+ | 7.79 EUR |
| 25+ | 7.42 EUR |
| ATS-19E-15-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X25MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.969" (50.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.969" (50.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.44°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 50X50X25MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.969" (50.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.969" (50.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.44°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-14C-191-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.88 EUR |
| 10+ | 9.62 EUR |
| 25+ | 9.17 EUR |
| ATS-HP-F5L70S52W-215 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEAT PIPE FLAT 3X6.44X70MM
Packaging: Bulk
Material: Copper
Length: 2.756" (70.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.254" (6.44mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.118" (3.00mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Description: HEAT PIPE FLAT 3X6.44X70MM
Packaging: Bulk
Material: Copper
Length: 2.756" (70.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.254" (6.44mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.118" (3.00mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-12A-204-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 54X54X12MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.126" (54.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.126" (54.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM
Fin Height: 0.472" (12.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 54X54X12MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.126" (54.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.126" (54.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM
Fin Height: 0.472" (12.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.61 EUR |
| 10+ | 8.5 EUR |
| 25+ | 8.1 EUR |
| ATS-08G-49-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.04 EUR |
| 10+ | 7.13 EUR |
| 25+ | 6.79 EUR |
| ATS-09G-79-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 26.36°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.04 EUR |
| 10+ | 7.13 EUR |
| 25+ | 6.79 EUR |
| ATS-17F-26-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 70X70X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.756" (70.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.756" (70.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 14.20°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 70X70X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.756" (70.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.756" (70.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 14.20°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 15.88 EUR |
| 10+ | 14.04 EUR |
| 25+ | 13.37 EUR |
| ATS-TEC30-36-017 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: TEC MODULE, 30X30X3.6
Packaging: Bulk
Features: Lead Wires, Sealed - Silicone RTV
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Height: 3.60mm
Delta Tmax @ Th: 68°C @ 27°C
Qmax @ Th: 26.7W @ 27°C
Current - Max: 3 A
Voltage - Max: 15.4 V
Resistance: 3.42 Ohms
Number of Stages: 1
Description: TEC MODULE, 30X30X3.6
Packaging: Bulk
Features: Lead Wires, Sealed - Silicone RTV
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Height: 3.60mm
Delta Tmax @ Th: 68°C @ 27°C
Qmax @ Th: 26.7W @ 27°C
Current - Max: 3 A
Voltage - Max: 15.4 V
Resistance: 3.42 Ohms
Number of Stages: 1
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.96 EUR |
| 5+ | 25.33 EUR |
| 10+ | 24.66 EUR |
| 30+ | 23.63 EUR |
| 50+ | 23.17 EUR |
| ATS-TEC30-44-082 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.00mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 45.5W @ 27°C
Current - Max: 9 A
Voltage - Max: 8.61 V
Resistance: 750 mOhms
Number of Stages: 1
Description: TEC Module 30x30x3mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.00mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 45.5W @ 27°C
Current - Max: 9 A
Voltage - Max: 8.61 V
Resistance: 750 mOhms
Number of Stages: 1
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 28.71 EUR |
| 5+ | 26.96 EUR |
| 10+ | 26.24 EUR |
| ATS-TEC30-64-086 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3.2mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.20mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 65.7W @ 27°C
Current - Max: 13 A
Voltage - Max: 8.61 V
Resistance: 520 mOhms
Number of Stages: 1
Description: TEC Module 30x30x3.2mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.20mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 65.7W @ 27°C
Current - Max: 13 A
Voltage - Max: 8.61 V
Resistance: 520 mOhms
Number of Stages: 1
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 30.62 EUR |
| 5+ | 28.78 EUR |
| 10+ | 28.02 EUR |
| ATS-TEC30-74-084 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3.1mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.10mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 75.9W @ 27°C
Current - Max: 15 A
Voltage - Max: 8.61 V
Resistance: 450 mOhms
Number of Stages: 1
Description: TEC Module 30x30x3.1mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.10mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 75.9W @ 27°C
Current - Max: 15 A
Voltage - Max: 8.61 V
Resistance: 450 mOhms
Number of Stages: 1
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 34.02 EUR |
| 5+ | 31.95 EUR |
| 10+ | 31.1 EUR |
| ATS-TEC30-59-085 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3.2mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.20mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 60.7W @ 27°C
Current - Max: 12 A
Voltage - Max: 8.61 V
Resistance: 560 mOhms
Number of Stages: 1
Description: TEC Module 30x30x3.2mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.20mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 60.7W @ 27°C
Current - Max: 12 A
Voltage - Max: 8.61 V
Resistance: 560 mOhms
Number of Stages: 1
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 34.5 EUR |
| 5+ | 32.42 EUR |
| 10+ | 31.56 EUR |
| 25+ | 30.45 EUR |
| ATS-11D-96-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.04 EUR |
| 10+ | 9.77 EUR |
| 25+ | 9.31 EUR |
| ATS-NVA2-3554-C3-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK JETSON ORIN NX NANO SUP
Packaging: Box
Material: Aluminum Alloy
Length: 2.264" (57.50mm)
Shape: Rectangular, Fins
Type: Top Mount with Fan
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson, Orin NX
Attachment Method: Bolt On, Thermal Material
Thermal Resistance @ Forced Air Flow: 0.94°C/W @ 200 LFM
Thermal Resistance @ Natural: 0.94°C/W
Fin Height: 0.905" (23.00mm)
Material Finish: Blue Anodized
Description: HEATSINK JETSON ORIN NX NANO SUP
Packaging: Box
Material: Aluminum Alloy
Length: 2.264" (57.50mm)
Shape: Rectangular, Fins
Type: Top Mount with Fan
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson, Orin NX
Attachment Method: Bolt On, Thermal Material
Thermal Resistance @ Forced Air Flow: 0.94°C/W @ 200 LFM
Thermal Resistance @ Natural: 0.94°C/W
Fin Height: 0.905" (23.00mm)
Material Finish: Blue Anodized
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 80.31 EUR |
| 10+ | 71.07 EUR |
| 25+ | 67.69 EUR |
| 50+ | 65.24 EUR |
| ATS-NVP-3681-C1-R1 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: PLATE NVIDA TTP ORIN NANO/NX
Packaging: Box
Material: Aluminum
Length: 2.480" (63.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson Orin Nano, Orin NX
Attachment Method: Bolt On, Thermal Material
Fin Height: 0.197" (5.00mm)
Material Finish: Black Anodized
Description: PLATE NVIDA TTP ORIN NANO/NX
Packaging: Box
Material: Aluminum
Length: 2.480" (63.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson Orin Nano, Orin NX
Attachment Method: Bolt On, Thermal Material
Fin Height: 0.197" (5.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-10G-39-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 57.9X60.96X5.84MM T766
Packaging: Bulk
Material: Aluminum
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 2.400" (60.96mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM
Fin Height: 0.230" (5.84mm)
Material Finish: Blue Anodized
Description: HEATSINK 57.9X60.96X5.84MM T766
Packaging: Bulk
Material: Aluminum
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 2.400" (60.96mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM
Fin Height: 0.230" (5.84mm)
Material Finish: Blue Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-16A-16-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 54X54X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.126" (54.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.126" (54.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 54X54X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.126" (54.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.126" (54.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.96 EUR |
| 10+ | 8.82 EUR |
| 25+ | 8.4 EUR |
| ATS-13F-13-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.969" (50.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.969" (50.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.70°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 50X50X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.969" (50.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.969" (50.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.70°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.47 EUR |
| 10+ | 8.38 EUR |
| 25+ | 7.98 EUR |
| ATS-13F-129-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 60X60X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.62 EUR |
| 10+ | 10.28 EUR |
| 25+ | 9.79 EUR |
| ATS-02B-07-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 17.00°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 17.00°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC50-195-185 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 50x50x3.3mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 50.00mm L x 50.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.30mm
Delta Tmax @ Th: 68°C @ 27°C
Qmax @ Th: 200.0W @ 27°C
Current - Max: 20 A
Voltage - Max: 15.4 V
Resistance: 580 mOhms
Number of Stages: 1
Description: TEC Module 50x50x3.3mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 50.00mm L x 50.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.30mm
Delta Tmax @ Th: 68°C @ 27°C
Qmax @ Th: 200.0W @ 27°C
Current - Max: 20 A
Voltage - Max: 15.4 V
Resistance: 580 mOhms
Number of Stages: 1
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 82.32 EUR |
| 5+ | 77.32 EUR |
| 10+ | 75.28 EUR |
| 25+ | 72.65 EUR |
| ATS-08B-03-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.85°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.85°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.27 EUR |
| 10+ | 7.32 EUR |
| 25+ | 6.97 EUR |
| ATS-09D-73-C2-R0 |
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Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 28.85°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 25X25X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 28.85°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.64 EUR |
| 10+ | 6.75 EUR |
| 25+ | 6.43 EUR |
| ATS-HP-D6L150S71W-129 |
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Hersteller: Advanced Thermal Solutions Inc.
Liquid Cold Plates, LiLiquid Cold Plates, Liquid Cooling & Heat Pipes Heat Pipe, Copper, High Performance, Round, 150mm, 6mm dia.
Liquid Cold Plates, LiLiquid Cold Plates, Liquid Cooling & Heat Pipes Heat Pipe, Copper, High Performance, Round, 150mm, 6mm dia.
auf Bestellung 49 Stücke:
Lieferzeit 14-21 Tag (e)Im Einkaufswagen Stück im Wert von UAH
























