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163-PGM15066-10T Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA TIN
Produkt ist nicht verfügbar
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163-PGM15067-10T Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA TIN
Produkt ist nicht verfügbar
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169-PGM13001-51 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
175-PGM16003-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
175-PGM16003-11H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
175-PGM16008-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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175-PGM16010-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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179-PGM15011-10H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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180-PGM18007-41 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
181-PGM18040-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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181-PGM18041-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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191-PGM18015-10T Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA TIN
Produkt ist nicht verfügbar
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191-PGM18018-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PG17043-10H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PGM17025-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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192-PGM17025-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PGM17043-10H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PGM17043-11H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
208-PGM17017-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
209-PGM17020-10H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
209-PGM17030-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
209-PGM17046-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
223-PGM18039-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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224-PGM15038-11H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
229-PGM16015-10T Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
232-PGM17037-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
233-PGM18039-51 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
257-PGM20012-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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281-PGM18037-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-PGM06002-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-PGM07002-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
37-PGM10012-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
37-PGM10012-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
37-PGM10013-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
441-PGG21001-40 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
441-PPG21001-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-PGM08003-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
65-PGM10008-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
65-PGM10008-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
66-PGM11054-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM10005-11H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11032-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11032-10H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11032-10T Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11032-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11033-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11033-10H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11033-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PGM11030-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PGM11031-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PGM11053-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
77-PGM10015-11 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PGM12015-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PGM15059-10 80-PGM15059-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
81-PGM09001-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM10003-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM11009-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM11010-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM11010-11H Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM11010-40 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
163-PGM15066-10T 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
163-PGM15067-10T 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
169-PGM13001-51 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
175-PGM16003-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
175-PGM16003-11H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
175-PGM16008-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
175-PGM16010-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
179-PGM15011-10H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
180-PGM18007-41 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
181-PGM18040-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
181-PGM18041-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
191-PGM18015-10T 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
191-PGM18018-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PG17043-10H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PGM17025-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PGM17025-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PGM17043-10H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
192-PGM17043-11H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
208-PGM17017-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
209-PGM17020-10H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
209-PGM17030-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
209-PGM17046-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
223-PGM18039-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
224-PGM15038-11H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
229-PGM16015-10T 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
232-PGM17037-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
233-PGM18039-51 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
257-PGM20012-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
281-PGM18037-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-PGM06002-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-PGM07002-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
37-PGM10012-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
37-PGM10012-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
37-PGM10013-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
441-PGG21001-40 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
441-PPG21001-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-PGM08003-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
65-PGM10008-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
65-PGM10008-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
66-PGM11054-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM10005-11H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11032-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11032-10H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PGM11032-10T 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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68-PGM11032-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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68-PGM11033-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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68-PGM11033-10H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
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68-PGM11033-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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69-PGM11030-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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69-PGM11031-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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69-PGM11053-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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77-PGM10015-11 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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80-PGM12015-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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80-PGM15059-10 14033-pga-socket-header.pdf
80-PGM15059-10
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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81-PGM09001-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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84-PGM10003-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM11009-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM11010-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PGM11010-11H 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
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84-PGM11010-40 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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