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08-600-10 08-600-10 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 8POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 1361 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.08 EUR
10+ 2.67 EUR
100+ 2.39 EUR
500+ 1.99 EUR
1000+ 1.71 EUR
Mindestbestellmenge: 6
14-600-10 14-600-10 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 14POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.98 EUR
26+ 3.32 EUR
104+ 3.1 EUR
Mindestbestellmenge: 5
16-600-10 16-600-10 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 16POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 1003 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.45 EUR
23+ 3.87 EUR
115+ 3.46 EUR
506+ 2.88 EUR
Mindestbestellmenge: 4
20-600-10 20-600-10 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 20POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
auf Bestellung 261 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.96 EUR
10+ 4.51 EUR
100+ 3.97 EUR
Mindestbestellmenge: 4
08-650-10 08-650-10 Aries Electronics 12033-header-covers.pdf Description: .27 COVER 8 PIN
auf Bestellung 1607 Stücke:
Lieferzeit 10-14 Tag (e)
14-650-10 14-650-10 Aries Electronics 12033-header-covers.pdf Description: .27" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
4+5 EUR
10+ 4.54 EUR
Mindestbestellmenge: 4
14-650-20 14-650-20 Aries Electronics 12033-header-covers.pdf Description: .51" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.61 EUR
10+ 5.1 EUR
Mindestbestellmenge: 4
14-650-30 14-650-30 Aries Electronics 12033-header-covers.pdf Description: .65" COVER 14 PIN
Produkt ist nicht verfügbar
14-650-40 14-650-40 Aries Electronics 12033-header-covers.pdf Description: .90" COVER 14 PIN
Produkt ist nicht verfügbar
16-650-10 16-650-10 Aries Electronics 12033-header-covers.pdf Description: .27" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
16-650-20 16-650-20 Aries Electronics 12033-header-covers.pdf Description: .51" COVER 16 PIN
Produkt ist nicht verfügbar
16-650-30 16-650-30 Aries Electronics 12033-header-covers.pdf Description: .65" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.05 EUR
10+ 4.58 EUR
100+ 4.04 EUR
Mindestbestellmenge: 4
16-650-40 16-650-40 Aries Electronics 12033-header-covers.pdf Description: .90" COVER 16 PIN
Produkt ist nicht verfügbar
20-650-10 20-650-10 Aries Electronics 12033-header-covers.pdf Description: .27" COVER 20 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 20
Accessory Type: Cap (Cover)
auf Bestellung 78 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.22 EUR
10+ 7.46 EUR
25+ 7.07 EUR
50+ 6.91 EUR
Mindestbestellmenge: 3
25-0600-10 25-0600-10 Aries Electronics 12034-strip-line-header.pdf Description: CONN HDR DIP FORK 25POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
auf Bestellung 706 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.27 EUR
10+ 5.68 EUR
100+ 5 EUR
Mindestbestellmenge: 3
14-810-90R 14-810-90R Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 814 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.44 EUR
10+ 15.7 EUR
25+ 14.79 EUR
50+ 14.41 EUR
100+ 14.03 EUR
250+ 12.51 EUR
500+ 11.76 EUR
Mindestbestellmenge: 2
LP300 LP300 Aries Electronics 16003-program-shorting-plug.pdf Description: CONN SCKT SHORTING PLUG FOR 0.3"
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.28 EUR
10+ 3.89 EUR
100+ 3.43 EUR
Mindestbestellmenge: 5
12-0511-10 12-0511-10 Aries Electronics 12008-strip-line-socket.pdf Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.04 EUR
10+ 6.4 EUR
100+ 5.64 EUR
Mindestbestellmenge: 3
20-0511-10 20-0511-10 Aries Electronics 12008-strip-line-socket.pdf Description: CONN SOCKET SIP 20POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 274 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.43 EUR
10+ 8.57 EUR
100+ 7.55 EUR
Mindestbestellmenge: 2
25-0511-10 25-0511-10 Aries Electronics 12008-strip-line-socket.pdf Description: CONN SOCKET SIP 25POS TIN
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 297 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.2 EUR
16+ 11.93 EUR
104+ 10.45 EUR
Mindestbestellmenge: 2
34-0511-10 34-0511-10 Aries Electronics 12008-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
12-0501-30 12-0501-30 Aries Electronics 12009-strip-line-socket.pdf Description: CONN SOCKET SIP 12POS TIN
Produkt ist nicht verfügbar
20-0501-30 20-0501-30 Aries Electronics 12009-strip-line-socket.pdf Description: CONN SOCKET SIP 20POS TIN
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
25-0501-30 25-0501-30 Aries Electronics 12009-strip-line-socket.pdf Description: CONN SOCKET SIP 25POS TIN
Produkt ist nicht verfügbar
34-0501-30 34-0501-30 Aries Electronics 12009-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
Produkt ist nicht verfügbar
25-0513-10 25-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 699 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.41 EUR
10+ 5.81 EUR
100+ 5.12 EUR
Mindestbestellmenge: 3
25-0503-30 25-0503-30 Aries Electronics 12014-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.49 EUR
10+ 19.94 EUR
100+ 17.38 EUR
C8108-04 C8108-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 8POS TIN
Produkt ist nicht verfügbar
C8114-04 C8114-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 14POS TIN
Produkt ist nicht verfügbar
C8116-04 C8116-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Produkt ist nicht verfügbar
C8118-04 C8118-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
C8120-04 C8120-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
C8122-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 22POS TIN
Produkt ist nicht verfügbar
C8124-04 C8124-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 24POS TIN
Produkt ist nicht verfügbar
C8128-04 C8128-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 28POS TIN
Produkt ist nicht verfügbar
C8140-04 C8140-04 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 40POS TIN
Produkt ist nicht verfügbar
C9108-00 C9108-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
C9114-00 C9114-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
C9116-00 C9116-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
C9118-00 C9118-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
C9120-00 C9120-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
C9122-00 C9122-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
C9124-00 C9124-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
C9128-00 C9128-00 Aries Electronics C81%2CC91.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
C9140-00 C9140-00 Aries Electronics C81,C91.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
84-537-21 84-537-21 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SOCKET PLCC ZIF 84POS GOLD
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+513.08 EUR
40-516-10 40-516-10 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Produkt ist nicht verfügbar
24-516-10 24-516-10 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
20-823-90 20-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1096 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.4 EUR
10+ 19.86 EUR
25+ 19.1 EUR
50+ 18.33 EUR
100+ 17.32 EUR
250+ 15.79 EUR
500+ 14.77 EUR
1000+ 13.55 EUR
40-526-10 40-526-10 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.68 EUR
11+ 21.86 EUR
110+ 19.06 EUR
44-547-11 44-547-11 Aries Electronics 10015-universal-soic-zif-test-socket.pdf Description: CONN SOCKET SOIC ZIF 44POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+386.07 EUR
44-653000-10 44-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
68-653000-10 68-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
18-600-10 18-600-10 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 18POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.89 EUR
10+ 4.44 EUR
Mindestbestellmenge: 4
40-600-10 40-600-10 Aries Electronics 12032-dip-header.pdf Description: DIP HEADER 40 PIN .600
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
24-6554-10 24-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.67 EUR
10+ 19.21 EUR
30+ 18.47 EUR
50+ 17.73 EUR
100+ 16.74 EUR
24-6554-11 24-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.57 EUR
10+ 27.65 EUR
30+ 26.46 EUR
50+ 25.61 EUR
100+ 24.75 EUR
28-6554-10 28-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.73 EUR
18+ 21.93 EUR
27+ 21.08 EUR
54+ 20.24 EUR
28-6554-11 28-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)
1+34.27 EUR
18+ 29.99 EUR
32-6554-10 32-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 246 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.33 EUR
16+ 22.82 EUR
32+ 21.63 EUR
56+ 21.32 EUR
104+ 18.81 EUR
08-600-10 12032-dip-header.pdf
08-600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 8POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 1361 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.08 EUR
10+ 2.67 EUR
100+ 2.39 EUR
500+ 1.99 EUR
1000+ 1.71 EUR
Mindestbestellmenge: 6
14-600-10 12032-dip-header.pdf
14-600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 14POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.98 EUR
26+ 3.32 EUR
104+ 3.1 EUR
Mindestbestellmenge: 5
16-600-10 12032-dip-header.pdf
16-600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 16POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 1003 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.45 EUR
23+ 3.87 EUR
115+ 3.46 EUR
506+ 2.88 EUR
Mindestbestellmenge: 4
20-600-10 12032-dip-header.pdf
20-600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 20POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
auf Bestellung 261 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.96 EUR
10+ 4.51 EUR
100+ 3.97 EUR
Mindestbestellmenge: 4
08-650-10 12033-header-covers.pdf
08-650-10
Hersteller: Aries Electronics
Description: .27 COVER 8 PIN
auf Bestellung 1607 Stücke:
Lieferzeit 10-14 Tag (e)
14-650-10 12033-header-covers.pdf
14-650-10
Hersteller: Aries Electronics
Description: .27" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5 EUR
10+ 4.54 EUR
Mindestbestellmenge: 4
14-650-20 12033-header-covers.pdf
14-650-20
Hersteller: Aries Electronics
Description: .51" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.61 EUR
10+ 5.1 EUR
Mindestbestellmenge: 4
14-650-30 12033-header-covers.pdf
14-650-30
Hersteller: Aries Electronics
Description: .65" COVER 14 PIN
Produkt ist nicht verfügbar
14-650-40 12033-header-covers.pdf
14-650-40
Hersteller: Aries Electronics
Description: .90" COVER 14 PIN
Produkt ist nicht verfügbar
16-650-10 12033-header-covers.pdf
16-650-10
Hersteller: Aries Electronics
Description: .27" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
16-650-20 12033-header-covers.pdf
16-650-20
Hersteller: Aries Electronics
Description: .51" COVER 16 PIN
Produkt ist nicht verfügbar
16-650-30 12033-header-covers.pdf
16-650-30
Hersteller: Aries Electronics
Description: .65" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.05 EUR
10+ 4.58 EUR
100+ 4.04 EUR
Mindestbestellmenge: 4
16-650-40 12033-header-covers.pdf
16-650-40
Hersteller: Aries Electronics
Description: .90" COVER 16 PIN
Produkt ist nicht verfügbar
20-650-10 12033-header-covers.pdf
20-650-10
Hersteller: Aries Electronics
Description: .27" COVER 20 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 20
Accessory Type: Cap (Cover)
auf Bestellung 78 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.22 EUR
10+ 7.46 EUR
25+ 7.07 EUR
50+ 6.91 EUR
Mindestbestellmenge: 3
25-0600-10 12034-strip-line-header.pdf
25-0600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 25POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
auf Bestellung 706 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.27 EUR
10+ 5.68 EUR
100+ 5 EUR
Mindestbestellmenge: 3
14-810-90R 13002-vertical-display-socket.pdf
14-810-90R
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 814 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.44 EUR
10+ 15.7 EUR
25+ 14.79 EUR
50+ 14.41 EUR
100+ 14.03 EUR
250+ 12.51 EUR
500+ 11.76 EUR
Mindestbestellmenge: 2
LP300 16003-program-shorting-plug.pdf
LP300
Hersteller: Aries Electronics
Description: CONN SCKT SHORTING PLUG FOR 0.3"
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.28 EUR
10+ 3.89 EUR
100+ 3.43 EUR
Mindestbestellmenge: 5
12-0511-10 12008-strip-line-socket.pdf
12-0511-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.04 EUR
10+ 6.4 EUR
100+ 5.64 EUR
Mindestbestellmenge: 3
20-0511-10 12008-strip-line-socket.pdf
20-0511-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 274 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.43 EUR
10+ 8.57 EUR
100+ 7.55 EUR
Mindestbestellmenge: 2
25-0511-10 12008-strip-line-socket.pdf
25-0511-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 297 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.2 EUR
16+ 11.93 EUR
104+ 10.45 EUR
Mindestbestellmenge: 2
34-0511-10 12008-strip-line-socket.pdf
34-0511-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
12-0501-30 12009-strip-line-socket.pdf
12-0501-30
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Produkt ist nicht verfügbar
20-0501-30 12009-strip-line-socket.pdf
20-0501-30
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
25-0501-30 12009-strip-line-socket.pdf
25-0501-30
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Produkt ist nicht verfügbar
34-0501-30 12009-strip-line-socket.pdf
34-0501-30
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Produkt ist nicht verfügbar
25-0513-10 12013-pin-line-collet-socket.pdf
25-0513-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 699 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.41 EUR
10+ 5.81 EUR
100+ 5.12 EUR
Mindestbestellmenge: 3
25-0503-30 12014-pin-line-collet-socket.pdf
25-0503-30
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.49 EUR
10+ 19.94 EUR
100+ 17.38 EUR
C8108-04 C81,C91.pdf
C8108-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Produkt ist nicht verfügbar
C8114-04 C81,C91.pdf
C8114-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Produkt ist nicht verfügbar
C8116-04 C81,C91.pdf
C8116-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Produkt ist nicht verfügbar
C8118-04 C81,C91.pdf
C8118-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
C8120-04 C81,C91.pdf
C8120-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
C8122-04 C81,C91.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
Produkt ist nicht verfügbar
C8124-04 C81,C91.pdf
C8124-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
Produkt ist nicht verfügbar
C8128-04 C81,C91.pdf
C8128-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
Produkt ist nicht verfügbar
C8140-04 C81,C91.pdf
C8140-04
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Produkt ist nicht verfügbar
C9108-00 C81,C91.pdf
C9108-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
C9114-00 C81,C91.pdf
C9114-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
C9116-00 C81,C91.pdf
C9116-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
C9118-00 C81,C91.pdf
C9118-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
C9120-00 C81,C91.pdf
C9120-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
C9122-00 C81,C91.pdf
C9122-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
C9124-00 C81,C91.pdf
C9124-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
C9128-00 C81%2CC91.pdf
C9128-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
C9140-00 C81,C91.pdf
C9140-00
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
84-537-21 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
84-537-21
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 84POS GOLD
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+513.08 EUR
40-516-10 516.pdf
40-516-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Produkt ist nicht verfügbar
24-516-10 516.pdf
24-516-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
20-823-90 13001-horizontal-display-socket.pdf
20-823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1096 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.4 EUR
10+ 19.86 EUR
25+ 19.1 EUR
50+ 18.33 EUR
100+ 17.32 EUR
250+ 15.79 EUR
500+ 14.77 EUR
1000+ 13.55 EUR
40-526-10 10018-low-profile-zif-test-socket.pdf
40-526-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+24.68 EUR
11+ 21.86 EUR
110+ 19.06 EUR
44-547-11 10015-universal-soic-zif-test-socket.pdf
44-547-11
Hersteller: Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+386.07 EUR
44-653000-10 18014-plcc-to-dip-adapter.pdf
44-653000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
68-653000-10 18014-plcc-to-dip-adapter.pdf
68-653000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
18-600-10 12032-dip-header.pdf
18-600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 18POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.89 EUR
10+ 4.44 EUR
Mindestbestellmenge: 4
40-600-10 12032-dip-header.pdf
40-600-10
Hersteller: Aries Electronics
Description: DIP HEADER 40 PIN .600
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
24-6554-10 10001-universal-dip-zif-test-socket.pdf
24-6554-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+21.67 EUR
10+ 19.21 EUR
30+ 18.47 EUR
50+ 17.73 EUR
100+ 16.74 EUR
24-6554-11 10001-universal-dip-zif-test-socket.pdf
24-6554-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+31.57 EUR
10+ 27.65 EUR
30+ 26.46 EUR
50+ 25.61 EUR
100+ 24.75 EUR
28-6554-10 10001-universal-dip-zif-test-socket.pdf
28-6554-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+24.73 EUR
18+ 21.93 EUR
27+ 21.08 EUR
54+ 20.24 EUR
28-6554-11 10001-universal-dip-zif-test-socket.pdf
28-6554-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+34.27 EUR
18+ 29.99 EUR
32-6554-10 10001-universal-dip-zif-test-socket.pdf
32-6554-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 246 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.33 EUR
16+ 22.82 EUR
32+ 21.63 EUR
56+ 21.32 EUR
104+ 18.81 EUR
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