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24-650-20 24-650-20 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 24 PIN .510
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
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28-650-10 28-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 28 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 28
Accessory Type: Cap (Cover)
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.95 EUR
10+8.39 EUR
25+7.56 EUR
Mindestbestellmenge: 2 Stücke
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40-650-10 40-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.78 EUR
10+8.88 EUR
25+8.41 EUR
50+8.22 EUR
100+7.83 EUR
Mindestbestellmenge: 3 Stücke
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08-810-90 08-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.34 EUR
10+14.71 EUR
25+13.85 EUR
50+13.49 EUR
Mindestbestellmenge: 2 Stücke
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14-810-90 14-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 331 Stücke:
Lieferzeit 10-14 Tag (e)
2+20.36 EUR
10+17.3 EUR
25+16.22 EUR
50+15.45 EUR
100+14.71 EUR
250+13.79 EUR
Mindestbestellmenge: 2 Stücke
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16-810-90 16-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 43 Stücke
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14-810-90T 14-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 256 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.91 EUR
10+16.11 EUR
25+15.18 EUR
50+14.79 EUR
100+14.4 EUR
250+12.84 EUR
Mindestbestellmenge: 2 Stücke
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16-810-90T 16-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 56 Stücke
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10-810-90C 10-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.74 EUR
10+19.33 EUR
25+18.11 EUR
50+17.26 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-810-90C 14-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
2+20.04 EUR
10+17.04 EUR
25+15.97 EUR
50+15.21 EUR
100+14.48 EUR
Mindestbestellmenge: 2 Stücke
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16-810-90C 16-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.04 EUR
10+18.73 EUR
25+17.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
08-823-90 08-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.15 EUR
10+15.52 EUR
25+14.66 EUR
Mindestbestellmenge: 2 Stücke
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14-823-90 14-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 314 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.03 EUR
10+17.86 EUR
25+16.74 EUR
50+15.95 EUR
100+15.18 EUR
250+14.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-6823-90 28-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
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40-6823-90 40-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 195 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.07 EUR
10+37.71 EUR
25+36.08 EUR
50+34.91 EUR
100+33.75 EUR
Im Einkaufswagen  Stück im Wert von  UAH
C9314-02 Aries Electronics C84%2CC93.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Produkt ist nicht verfügbar
 Mindestbestellmenge: 196 Stücke
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20-350001-10 20-350001-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 220 Stücke
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28-653000-10 28-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
1+92.09 EUR
17+75.4 EUR
34+71.8 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-650000-10 32-650000-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+85.87 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-450001-10 32-450001-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 8 Stücke
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28-350002-10 28-350002-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+45.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-10 24-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.96 EUR
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28-650000-10 28-650000-10 Aries Electronics 450001%2C650000_Series.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
1+142.36 EUR
17+116.56 EUR
34+111 EUR
51+107.87 EUR
102+102.73 EUR
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56-184M65 Aries Electronics Description: SOCKET ADAPTER QFP TO 184PGA
Number of Pins: 184
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 22 Stücke
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68-505-110 68-505-110 Aries Electronics 18028-plcc-to-pga-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
auf Bestellung 247 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.42 EUR
10+49.66 EUR
25+46.55 EUR
50+44.33 EUR
100+42.22 EUR
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18-6511-10 Aries Electronics Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 150 Stücke
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20-F40-10 20-F40-10 Aries Electronics 16008-thru-hole-female-dip-strip.pdf Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
auf Bestellung 191 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.01 EUR
10+32.3 EUR
100+27.45 EUR
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52-536-11 52-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
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24-516-11 24-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
 Mindestbestellmenge: 180 Stücke
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95-132I25 95-132I25 Aries Electronics 18017-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 132PGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3 Stücke
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96-100M65 Aries Electronics 96-100M65.pdf Description: SOCKET ADAPTER QFP TO 100PGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3 Stücke
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96-160M65 96-160M65 Aries Electronics 18020-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 160PGA
Produkt ist nicht verfügbar
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14-3625-21 Aries Electronics Description: CONN HDR DIP POST 14POS GOLD
Produkt ist nicht verfügbar
 Mindestbestellmenge: 26 Stücke
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25-0625-21 Aries Electronics 12036-pin-line-header.pdf Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Produkt ist nicht verfügbar
 Mindestbestellmenge: 49 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
96-208M50 96-208M50 Aries Electronics 18031-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 208PGA
Packaging: Bulk
Number of Pins: 208
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-536-11 32-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
40-516-11 40-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.54 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-600-11 16-600-11 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.64 EUR
23+6.12 EUR
115+5.46 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
10-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6574-10 24-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6574-11 24-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
 Mindestbestellmenge: 12 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-6574-10 28-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6574-11 28-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 22 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
32-6574-10 32-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
 Mindestbestellmenge: 30 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
32-6574-11 32-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
 Mindestbestellmenge: 20 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-6574-10 40-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
40-6574-11 40-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Produkt ist nicht verfügbar
 Mindestbestellmenge: 8 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
48-6574-10 48-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
 Mindestbestellmenge: 21 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
48-6574-11 48-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
 Mindestbestellmenge: 14 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-10 40-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 4749 Stücke:
Lieferzeit 10-14 Tag (e)
3+10.17 EUR
10+8.65 EUR
25+8.1 EUR
50+7.72 EUR
100+7.35 EUR
250+6.89 EUR
500+6.56 EUR
1000+6.25 EUR
2500+5.85 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-11 40-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.38 EUR
10+11.19 EUR
100+9.79 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1107741 1107741 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
auf Bestellung 579 Stücke:
Lieferzeit 10-14 Tag (e)
7+3.2 EUR
10+2.78 EUR
28+2.62 EUR
56+2.51 EUR
112+2.4 EUR
252+2.28 EUR
504+2.19 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1108800 1108800 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
auf Bestellung 526 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.84 EUR
10+2.42 EUR
49+2.17 EUR
98+2.06 EUR
147+2 EUR
294+1.9 EUR
Mindestbestellmenge: 8 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-6810-90 08-6810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-2810-90 10-2810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 593 Stücke:
Lieferzeit 10-14 Tag (e)
2+19.48 EUR
10+16.56 EUR
25+15.53 EUR
50+14.78 EUR
100+14.08 EUR
250+13.2 EUR
500+12.57 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-6810-90C 08-6810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
 Mindestbestellmenge: 55 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
04-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 4POS
Produkt ist nicht verfügbar
 Mindestbestellmenge: 334 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
06-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 6POS
Produkt ist nicht verfügbar
 Mindestbestellmenge: 209 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 8POS
Produkt ist nicht verfügbar
 Mindestbestellmenge: 209 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
10-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 152 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-650-20 12033-header-covers.pdf
24-650-20
Hersteller: Aries Electronics
Description: DIP HEADER COVER 24 PIN .510
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
28-650-10 12033-header-covers.pdf
28-650-10
Hersteller: Aries Electronics
Description: DIP HEADER COVER 28 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 28
Accessory Type: Cap (Cover)
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.95 EUR
10+8.39 EUR
25+7.56 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-650-10 12033-header-covers.pdf
40-650-10
Hersteller: Aries Electronics
Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.78 EUR
10+8.88 EUR
25+8.41 EUR
50+8.22 EUR
100+7.83 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-810-90 13002-vertical-display-socket.pdf
08-810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+16.34 EUR
10+14.71 EUR
25+13.85 EUR
50+13.49 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-810-90 13002-vertical-display-socket.pdf
14-810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 331 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+20.36 EUR
10+17.3 EUR
25+16.22 EUR
50+15.45 EUR
100+14.71 EUR
250+13.79 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-810-90 13002-vertical-display-socket.pdf
16-810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 43 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-810-90T 13002-vertical-display-socket.pdf
14-810-90T
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 256 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.91 EUR
10+16.11 EUR
25+15.18 EUR
50+14.79 EUR
100+14.4 EUR
250+12.84 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-810-90T 13002-vertical-display-socket.pdf
16-810-90T
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 56 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
10-810-90C 13004-vertical-display-socket.pdf
10-810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.74 EUR
10+19.33 EUR
25+18.11 EUR
50+17.26 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-810-90C 13004-vertical-display-socket.pdf
14-810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+20.04 EUR
10+17.04 EUR
25+15.97 EUR
50+15.21 EUR
100+14.48 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-810-90C 13004-vertical-display-socket.pdf
16-810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.04 EUR
10+18.73 EUR
25+17.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
08-823-90 13001-horizontal-display-socket.pdf
08-823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.15 EUR
10+15.52 EUR
25+14.66 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-823-90 13001-horizontal-display-socket.pdf
14-823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 314 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+21.03 EUR
10+17.86 EUR
25+16.74 EUR
50+15.95 EUR
100+15.18 EUR
250+14.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-6823-90 13001-horizontal-display-socket.pdf
28-6823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
40-6823-90 13001-horizontal-display-socket.pdf
40-6823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 195 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+43.07 EUR
10+37.71 EUR
25+36.08 EUR
50+34.91 EUR
100+33.75 EUR
Im Einkaufswagen  Stück im Wert von  UAH
C9314-02 C84%2CC93.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 196 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-350001-10 18010-soic-and-soj-to-dip-adapter.pdf
20-350001-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 220 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-653000-10 18014-plcc-to-dip-adapter.pdf
28-653000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+92.09 EUR
17+75.4 EUR
34+71.8 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-650000-10 18011-soic-and-soj-to-dip-adapter.pdf
32-650000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+85.87 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-450001-10 18011-soic-and-soj-to-dip-adapter.pdf
32-450001-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 8 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-350002-10 18010-soic-and-soj-to-dip-adapter.pdf
28-350002-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+45.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
24-350000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+43.96 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-650000-10 450001%2C650000_Series.pdf
28-650000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+142.36 EUR
17+116.56 EUR
34+111 EUR
51+107.87 EUR
102+102.73 EUR
Im Einkaufswagen  Stück im Wert von  UAH
56-184M65
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 184PGA
Number of Pins: 184
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 22 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
68-505-110 18028-plcc-to-pga-adapter.pdf
68-505-110
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
auf Bestellung 247 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+58.42 EUR
10+49.66 EUR
25+46.55 EUR
50+44.33 EUR
100+42.22 EUR
Im Einkaufswagen  Stück im Wert von  UAH
18-6511-10
Hersteller: Aries Electronics
Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 150 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-F40-10 16008-thru-hole-female-dip-strip.pdf
20-F40-10
Hersteller: Aries Electronics
Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
auf Bestellung 191 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+38.01 EUR
10+32.3 EUR
100+27.45 EUR
Im Einkaufswagen  Stück im Wert von  UAH
52-536-11
52-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-516-11 516.pdf
24-516-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
95-132I25 18017-qfp-to-pga-adapter.pdf
95-132I25
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 132PGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
96-100M65 96-100M65.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
96-160M65 18020-qfp-to-pga-adapter.pdf
96-160M65
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 160PGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-3625-21
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 14POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 26 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
25-0625-21 12036-pin-line-header.pdf
Hersteller: Aries Electronics
Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Produkt ist nicht verfügbar
Mindestbestellmenge: 49 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
96-208M50 18031-qfp-to-pga-adapter.pdf
96-208M50
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 208PGA
Packaging: Bulk
Number of Pins: 208
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-536-11
32-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
40-516-11 516.pdf
40-516-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+46.54 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-600-11 12032-dip-header.pdf
16-600-11
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.64 EUR
23+6.12 EUR
115+5.46 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
10-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
Mindestbestellmenge: 12 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 22 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
32-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 30 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
32-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 20 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
40-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Produkt ist nicht verfügbar
Mindestbestellmenge: 8 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
48-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
48-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 14 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 4749 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.17 EUR
10+8.65 EUR
25+8.1 EUR
50+7.72 EUR
100+7.35 EUR
250+6.89 EUR
500+6.56 EUR
1000+6.25 EUR
2500+5.85 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-11
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.38 EUR
10+11.19 EUR
100+9.79 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1107741 14005-oscillator-socket.pdf
1107741
Hersteller: Aries Electronics
Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
auf Bestellung 579 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.2 EUR
10+2.78 EUR
28+2.62 EUR
56+2.51 EUR
112+2.4 EUR
252+2.28 EUR
504+2.19 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1108800 14005-oscillator-socket.pdf
1108800
Hersteller: Aries Electronics
Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
auf Bestellung 526 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
8+2.84 EUR
10+2.42 EUR
49+2.17 EUR
98+2.06 EUR
147+2 EUR
294+1.9 EUR
Mindestbestellmenge: 8 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-6810-90 13002-vertical-display-socket.pdf
08-6810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-2810-90 13002-vertical-display-socket.pdf
10-2810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 593 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+19.48 EUR
10+16.56 EUR
25+15.53 EUR
50+14.78 EUR
100+14.08 EUR
250+13.2 EUR
500+12.57 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-6810-90C 13004-vertical-display-socket.pdf
08-6810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 55 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
04-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 4POS
Produkt ist nicht verfügbar
Mindestbestellmenge: 334 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
06-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 6POS
Produkt ist nicht verfügbar
Mindestbestellmenge: 209 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 8POS
Produkt ist nicht verfügbar
Mindestbestellmenge: 209 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
10-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
Im Einkaufswagen  Stück im Wert von  UAH