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18-650-10 18-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
24-650-10 24-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 24 PIN .270
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
24-650-20 24-650-20 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 24 PIN .510
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
28-650-10 28-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 28 PIN .270
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.92 EUR
10+ 8.1 EUR
25+ 7.67 EUR
Mindestbestellmenge: 2
40-650-10 40-650-10 Aries Electronics 12033-header-covers.pdf Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.22 EUR
10+ 7.46 EUR
25+ 7.07 EUR
50+ 6.91 EUR
100+ 6.58 EUR
Mindestbestellmenge: 3
08-810-90 08-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.73 EUR
10+ 12.36 EUR
25+ 11.64 EUR
50+ 11.34 EUR
Mindestbestellmenge: 2
14-810-90 14-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.34 EUR
10+ 15.61 EUR
100+ 13.95 EUR
Mindestbestellmenge: 2
16-810-90 16-810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
14-810-90T 14-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 256 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.05 EUR
10+ 13.54 EUR
25+ 12.76 EUR
50+ 12.43 EUR
100+ 12.1 EUR
250+ 10.79 EUR
Mindestbestellmenge: 2
16-810-90T 16-810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
10-810-90C 10-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.44 EUR
10+ 16.34 EUR
25+ 15.71 EUR
14-810-90C 14-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.13 EUR
10+ 17.85 EUR
25+ 17.16 EUR
50+ 16.48 EUR
100+ 15.56 EUR
16-810-90C 16-810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.91 EUR
10+ 18.53 EUR
08-823-90 08-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.41 EUR
10+ 13.04 EUR
25+ 12.32 EUR
Mindestbestellmenge: 2
14-823-90 14-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.85 EUR
10+ 16.96 EUR
25+ 15.98 EUR
50+ 15.57 EUR
100+ 15.16 EUR
250+ 13.52 EUR
28-6823-90 28-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
40-6823-90 40-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
C9314-02 Aries Electronics C84,C93.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Produkt ist nicht verfügbar
20-350001-10 20-350001-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-653000-10 28-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
1+69.48 EUR
17+ 60.84 EUR
32-650000-10 32-650000-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+66.79 EUR
32-450001-10 32-450001-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-350002-10 28-350002-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.78 EUR
10+ 31.33 EUR
25+ 29.98 EUR
50+ 29.01 EUR
24-350000-10 24-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.35 EUR
10+ 28.32 EUR
28-650000-10 28-650000-10 Aries Electronics 450001%2C650000_Series.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
1+122.11 EUR
17+ 112.06 EUR
34+ 107.75 EUR
51+ 104.16 EUR
102+ 98.41 EUR
56-184M65 Aries Electronics Description: SOCKET ADAPTER QFP TO 184PGA
Produkt ist nicht verfügbar
68-505-110 68-505-110 Aries Electronics 18028-plcc-to-pga-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
auf Bestellung 799 Stücke:
Lieferzeit 10-14 Tag (e)
1+42.82 EUR
10+ 37.51 EUR
25+ 35.88 EUR
50+ 34.73 EUR
100+ 33.57 EUR
250+ 31.72 EUR
500+ 30.79 EUR
18-6511-10 Aries Electronics Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
20-F40-10 20-F40-10 Aries Electronics 16008-thru-hole-female-dip-strip.pdf Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
auf Bestellung 373 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.8 EUR
10+ 26.69 EUR
100+ 21.99 EUR
52-536-11 52-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
24-516-11 24-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
95-132I25 95-132I25 Aries Electronics 18017-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 132PGA
Produkt ist nicht verfügbar
96-100M65 Aries Electronics 96-100M65.pdf Description: SOCKET ADAPTER QFP TO 100PGA
Produkt ist nicht verfügbar
96-160M65 96-160M65 Aries Electronics 18020-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 160PGA
Produkt ist nicht verfügbar
14-3625-21 Aries Electronics Description: CONN HDR DIP POST 14POS GOLD
Produkt ist nicht verfügbar
25-0625-21 Aries Electronics 12036-pin-line-header.pdf Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Produkt ist nicht verfügbar
96-208M50 96-208M50 Aries Electronics 18031-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 208PGA
Produkt ist nicht verfügbar
32-536-11 32-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
40-516-11 40-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.7 EUR
10+ 29.2 EUR
16-600-11 16-600-11 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 323 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.39 EUR
10+ 4.89 EUR
100+ 4.31 EUR
Mindestbestellmenge: 4
10-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
24-6574-10 24-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
24-6574-11 24-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
28-6574-10 28-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-6574-11 28-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
32-6574-10 32-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
32-6574-11 32-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
40-6574-10 40-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
40-6574-11 40-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Produkt ist nicht verfügbar
48-6574-10 48-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
48-6574-11 48-6574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
40-0518-10 40-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 228 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.56 EUR
10+ 5.96 EUR
100+ 5.25 EUR
Mindestbestellmenge: 3
40-0518-11 40-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.44 EUR
10+ 9.44 EUR
Mindestbestellmenge: 2
1107741 1107741 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
auf Bestellung 1377 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.57 EUR
14+ 1.32 EUR
25+ 1.27 EUR
50+ 1.24 EUR
100+ 1.19 EUR
250+ 1.08 EUR
500+ 0.97 EUR
1000+ 0.86 EUR
Mindestbestellmenge: 12
1108800 1108800 Aries Electronics 14005-oscillator-socket.pdf Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
auf Bestellung 2511 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.55 EUR
14+ 1.31 EUR
25+ 1.26 EUR
50+ 1.23 EUR
100+ 1.18 EUR
250+ 1.07 EUR
500+ 0.96 EUR
1000+ 0.86 EUR
2500+ 0.78 EUR
Mindestbestellmenge: 12
08-6810-90 08-6810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
10-2810-90 10-2810-90 Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 884 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.23 EUR
10+ 14.61 EUR
100+ 13.06 EUR
Mindestbestellmenge: 2
08-6810-90C 08-6810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
04-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 4POS
Produkt ist nicht verfügbar
06-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 6POS
Produkt ist nicht verfügbar
18-650-10 12033-header-covers.pdf
18-650-10
Hersteller: Aries Electronics
Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
24-650-10 12033-header-covers.pdf
24-650-10
Hersteller: Aries Electronics
Description: DIP HEADER COVER 24 PIN .270
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
24-650-20 12033-header-covers.pdf
24-650-20
Hersteller: Aries Electronics
Description: DIP HEADER COVER 24 PIN .510
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
28-650-10 12033-header-covers.pdf
28-650-10
Hersteller: Aries Electronics
Description: DIP HEADER COVER 28 PIN .270
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+8.92 EUR
10+ 8.1 EUR
25+ 7.67 EUR
Mindestbestellmenge: 2
40-650-10 12033-header-covers.pdf
40-650-10
Hersteller: Aries Electronics
Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.22 EUR
10+ 7.46 EUR
25+ 7.07 EUR
50+ 6.91 EUR
100+ 6.58 EUR
Mindestbestellmenge: 3
08-810-90 13002-vertical-display-socket.pdf
08-810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.73 EUR
10+ 12.36 EUR
25+ 11.64 EUR
50+ 11.34 EUR
Mindestbestellmenge: 2
14-810-90 13002-vertical-display-socket.pdf
14-810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.34 EUR
10+ 15.61 EUR
100+ 13.95 EUR
Mindestbestellmenge: 2
16-810-90 13002-vertical-display-socket.pdf
16-810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
14-810-90T 13002-vertical-display-socket.pdf
14-810-90T
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 256 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.05 EUR
10+ 13.54 EUR
25+ 12.76 EUR
50+ 12.43 EUR
100+ 12.1 EUR
250+ 10.79 EUR
Mindestbestellmenge: 2
16-810-90T 13002-vertical-display-socket.pdf
16-810-90T
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
10-810-90C 13004-vertical-display-socket.pdf
10-810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.44 EUR
10+ 16.34 EUR
25+ 15.71 EUR
14-810-90C 13004-vertical-display-socket.pdf
14-810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.13 EUR
10+ 17.85 EUR
25+ 17.16 EUR
50+ 16.48 EUR
100+ 15.56 EUR
16-810-90C 13004-vertical-display-socket.pdf
16-810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.91 EUR
10+ 18.53 EUR
08-823-90 13001-horizontal-display-socket.pdf
08-823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.41 EUR
10+ 13.04 EUR
25+ 12.32 EUR
Mindestbestellmenge: 2
14-823-90 13001-horizontal-display-socket.pdf
14-823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.85 EUR
10+ 16.96 EUR
25+ 15.98 EUR
50+ 15.57 EUR
100+ 15.16 EUR
250+ 13.52 EUR
28-6823-90 13001-horizontal-display-socket.pdf
28-6823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
40-6823-90 13001-horizontal-display-socket.pdf
40-6823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
C9314-02 C84,C93.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Produkt ist nicht verfügbar
20-350001-10 18010-soic-and-soj-to-dip-adapter.pdf
20-350001-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-653000-10 18014-plcc-to-dip-adapter.pdf
28-653000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+69.48 EUR
17+ 60.84 EUR
32-650000-10 18011-soic-and-soj-to-dip-adapter.pdf
32-650000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+66.79 EUR
32-450001-10 18011-soic-and-soj-to-dip-adapter.pdf
32-450001-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-350002-10 18010-soic-and-soj-to-dip-adapter.pdf
28-350002-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+35.78 EUR
10+ 31.33 EUR
25+ 29.98 EUR
50+ 29.01 EUR
24-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
24-350000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+32.35 EUR
10+ 28.32 EUR
28-650000-10 450001%2C650000_Series.pdf
28-650000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+122.11 EUR
17+ 112.06 EUR
34+ 107.75 EUR
51+ 104.16 EUR
102+ 98.41 EUR
56-184M65
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 184PGA
Produkt ist nicht verfügbar
68-505-110 18028-plcc-to-pga-adapter.pdf
68-505-110
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
auf Bestellung 799 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+42.82 EUR
10+ 37.51 EUR
25+ 35.88 EUR
50+ 34.73 EUR
100+ 33.57 EUR
250+ 31.72 EUR
500+ 30.79 EUR
18-6511-10
Hersteller: Aries Electronics
Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
20-F40-10 16008-thru-hole-female-dip-strip.pdf
20-F40-10
Hersteller: Aries Electronics
Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
auf Bestellung 373 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.8 EUR
10+ 26.69 EUR
100+ 21.99 EUR
52-536-11
52-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
24-516-11 516.pdf
24-516-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
95-132I25 18017-qfp-to-pga-adapter.pdf
95-132I25
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 132PGA
Produkt ist nicht verfügbar
96-100M65 96-100M65.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
Produkt ist nicht verfügbar
96-160M65 18020-qfp-to-pga-adapter.pdf
96-160M65
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 160PGA
Produkt ist nicht verfügbar
14-3625-21
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 14POS GOLD
Produkt ist nicht verfügbar
25-0625-21 12036-pin-line-header.pdf
Hersteller: Aries Electronics
Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Produkt ist nicht verfügbar
96-208M50 18031-qfp-to-pga-adapter.pdf
96-208M50
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 208PGA
Produkt ist nicht verfügbar
32-536-11
32-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Produkt ist nicht verfügbar
40-516-11 516.pdf
40-516-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+33.7 EUR
10+ 29.2 EUR
16-600-11 12032-dip-header.pdf
16-600-11
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 323 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.39 EUR
10+ 4.89 EUR
100+ 4.31 EUR
Mindestbestellmenge: 4
10-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
24-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
24-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
24-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
28-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
32-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
32-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
32-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
40-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
40-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
40-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Produkt ist nicht verfügbar
48-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
48-6574-11 10019-universal-zif-test-and-burn-in-socket.pdf
48-6574-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
40-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 228 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.56 EUR
10+ 5.96 EUR
100+ 5.25 EUR
Mindestbestellmenge: 3
40-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-11
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.44 EUR
10+ 9.44 EUR
Mindestbestellmenge: 2
1107741 14005-oscillator-socket.pdf
1107741
Hersteller: Aries Electronics
Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
auf Bestellung 1377 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.57 EUR
14+ 1.32 EUR
25+ 1.27 EUR
50+ 1.24 EUR
100+ 1.19 EUR
250+ 1.08 EUR
500+ 0.97 EUR
1000+ 0.86 EUR
Mindestbestellmenge: 12
1108800 14005-oscillator-socket.pdf
1108800
Hersteller: Aries Electronics
Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
auf Bestellung 2511 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.55 EUR
14+ 1.31 EUR
25+ 1.26 EUR
50+ 1.23 EUR
100+ 1.18 EUR
250+ 1.07 EUR
500+ 0.96 EUR
1000+ 0.86 EUR
2500+ 0.78 EUR
Mindestbestellmenge: 12
08-6810-90 13002-vertical-display-socket.pdf
08-6810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
10-2810-90 13002-vertical-display-socket.pdf
10-2810-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 884 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.23 EUR
10+ 14.61 EUR
100+ 13.06 EUR
Mindestbestellmenge: 2
08-6810-90C 13004-vertical-display-socket.pdf
08-6810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
04-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 4POS
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06-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 6POS
Produkt ist nicht verfügbar
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