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18-351000-10 18-351000-10 Aries Electronics 18036-ssop-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Bulk
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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20-351000-10 20-351000-10 Aries Electronics 18036-ssop-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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96-080M80 Aries Electronics 96-080M80.pdf Description: SOCKET ADAPTER QFP TO 80PGA
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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36-651000-10 Aries Electronics Description: SOCKET ADAPTER 36POS SSOP/DIP .6
Packaging: Bulk
Number of Pins: 36
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
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52-505-110 Aries Electronics 505_Series.pdf Description: SOCKET ADAPTER PLCC TO 52PGA
Packaging: Bulk
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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32-9513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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14-036-206 Aries Electronics 11012-male-female-dip-jumpers.pdf Description: CABLE DIP MALE/FEMALE 14POS GOLD
Packaging: Bulk
Connector Type: DIP to DIP, Reversed
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 3.00' (914.40mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
Produkt ist nicht verfügbar
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08-600-11 08-600-11 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 8POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 306 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.27 EUR
44+2.67 EUR
132+2.55 EUR
Mindestbestellmenge: 6
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32-655000-10 32-655000-10 Aries Electronics 18041-tsop-to-dip-adapter.pdf Description: SOCKET ADAPTER TSOP TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Silver
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
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18-350000-10 18-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.31 EUR
21+33.32 EUR
42+31.73 EUR
63+30.83 EUR
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14-680-191TC Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HDR MALE PIN 14POS TIN
Produkt ist nicht verfügbar
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08-305984-10 Aries Electronics 18086-aromat-relay-adapter.pdf Description: ADAPTER FOR TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
Produkt ist nicht verfügbar
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18-6810-90T 18-6810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.03 EUR
10+22.18 EUR
25+21.33 EUR
50+20.48 EUR
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16-6810-90T Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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14-823-90C Aries Electronics Description: IC SOCKET 14PIN VERT SCKT HORIZ
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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97-68340-P Aries Electronics 18025-qfp-to-pga-adapter.pdf Description: ADAPTER/PANEL QFP TO PGA 144POS
Produkt ist nicht verfügbar
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97-AQ132D Aries Electronics 18022-pqfp-to-pga-socket.pdf Description: SOCKET ADAPTER PQFP TO 132PGA
Produkt ist nicht verfügbar
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40-6554-18 Aries Electronics xx-x55x-1-8.pdf Description: CONN IC DIP SOCKET ZIF 40POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Produkt ist nicht verfügbar
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44-305263-20 Aries Electronics 18081-qfp-to-plcc-adapter.pdf Description: SOCKET ADAPTER QFP TO 44PLCC
Produkt ist nicht verfügbar
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44-547-11E 44-547-11E Aries Electronics 10015-universal-soic-zif-test-socket.pdf Description: CONN SOCKET SOIC ZIF 44POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+367.47 EUR
10+340.51 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-823-90CV0 Aries Electronics Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Obsolete
Produkt ist nicht verfügbar
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07-001-152FB Aries Electronics 11001-fusion-bonded-cable-jumpers.pdf Description: CABLE JUMPER 7POS 2.54MM 1"
Packaging: Bulk
Length: 1.000" (25.40mm)
Pitch: 0.100" (2.54mm)
Termination Style: Completely Exposed Wires on Both Sides with Protective Tab
Cable Type: Ribbon
Length - Exposed Ends: 0.125" (3.18mm)
Number of Conductors: 7
Produkt ist nicht verfügbar
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08-4513-10 08-4513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 1585 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.53 EUR
10+2.15 EUR
25+2.02 EUR
50+1.92 EUR
100+1.83 EUR
250+1.71 EUR
500+1.63 EUR
1000+1.55 EUR
Mindestbestellmenge: 7
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25-0625-11 25-0625-11 Aries Electronics 12036-pin-line-header.pdf Description: CONN HDR STRIP FORK 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.39 EUR
10+20.74 EUR
100+18.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-354W00-10 Aries Electronics 18073-dip-to-sowic-adapter.pdf Description: CONN ADAPTER 14PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Produkt ist nicht verfügbar
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16-354W00-10 Aries Electronics 18073-dip-to-sowic-adapter.pdf Description: CONN ADAPTER 16PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Produkt ist nicht verfügbar
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20-354W00-10 Aries Electronics 18073-dip-to-sowic-adapter.pdf Description: CONN ADAPTER 20PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Produkt ist nicht verfügbar
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24-354W00-10 Aries Electronics 18073-dip-to-sowic-adapter.pdf Description: CONN ADAPTER 24PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Produkt ist nicht verfügbar
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144-PRS12001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
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04-600-11 04-600-11 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 4POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
auf Bestellung 1053 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.62 EUR
60+2.13 EUR
120+2.03 EUR
540+1.69 EUR
1020+1.45 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
04-650-10 04-650-10 Aries Electronics 12033-header-covers.pdf Description: 4PIN HEADER COVER
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 4
Accessory Type: Cap (Cover)
auf Bestellung 524 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.93 EUR
10+4.19 EUR
25+3.93 EUR
50+3.74 EUR
100+3.56 EUR
250+3.34 EUR
500+3.18 EUR
Mindestbestellmenge: 4
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16-304235-10 Aries Electronics Description: 16-PIN SOCKET TO PIN ADAPTER
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
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16-304633-18 Aries Electronics Description: SOCKET ADAPTER 20PLCC TO 16DIP
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-350000-11-RC 08-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Tube
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 781 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.04 EUR
10+14.47 EUR
48+12.95 EUR
96+12.33 EUR
144+11.98 EUR
288+11.41 EUR
528+10.93 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
14-350000-11-RC 14-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 439 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.32 EUR
10+24.06 EUR
28+22.38 EUR
56+21.31 EUR
112+20.29 EUR
252+19.17 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-351000-11-RC 14-351000-11-RC Aries Electronics 351000_Series.pdf Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
16-350000-11-RC 16-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 553 Stücke:
Lieferzeit 10-14 Tag (e)
1+34.94 EUR
24+27.92 EUR
48+26.59 EUR
72+25.84 EUR
120+24.92 EUR
264+23.57 EUR
504+22.52 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-351000-11-RC 16-351000-11-RC Aries Electronics 351000_Series.pdf Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+47.68 EUR
Im Einkaufswagen  Stück im Wert von  UAH
18-351000-11-RC 18-351000-11-RC Aries Electronics 351000_Series.pdf Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Tube
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-350000-11-RC 18-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Tube
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.02 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-350000-11-RC 20-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 516 Stücke:
Lieferzeit 10-14 Tag (e)
1+39.85 EUR
19+32.37 EUR
38+30.82 EUR
57+29.95 EUR
114+28.53 EUR
266+26.87 EUR
513+25.66 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-350001-11-RC 20-350001-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-351000-11-RC 20-351000-11-RC Aries Electronics 351000_Series.pdf Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.4 EUR
19+35.26 EUR
38+33.58 EUR
57+32.63 EUR
114+31.07 EUR
266+29.27 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-650000-11-RC 24-650000-11-RC Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-11-RC 24-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Tube
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.28 EUR
16+35.58 EUR
32+33.88 EUR
64+32.27 EUR
112+31.02 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-650000-11-RC 28-650000-11-RC Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
1+119.49 EUR
17+97.83 EUR
34+93.17 EUR
51+90.54 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-350002-11-RC 28-350002-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: DIP to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-351000-11-RC 28-351000-11-RC Aries Electronics 351000_Series.pdf Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 166 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.28 EUR
14+31.78 EUR
28+30.26 EUR
56+28.82 EUR
112+27.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-651000-11-RC Aries Electronics Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-650000-11-RC 32-650000-11-RC Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-450001-11-RC 32-450001-11-RC Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
108-PRS12005-12 108-PRS12005-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+138.46 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-650000-10-P Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
42-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Tray
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PRS15057-12 Aries Electronics Description: ZIF PGA SOCKET 56PIN 15X15
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-675-191T 16-675-191T Aries Electronics 16004-program-header.pdf Description: CONN HDR MALE PIN 16POS TIN
Features: Programmable
Packaging: Tube
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.73 EUR
23+2.99 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
24-351000-10 Aries Electronics 18036-ssop-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-2810-90C 10-2810-90C Aries Electronics 13004-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.18 EUR
10+10.35 EUR
25+9.7 EUR
50+9.24 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
18-6810-90TWR Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
48-6645-18 Aries Electronics 18090-qfp-to-dip-adapter.pdf Description: SOCKET ADAPTER TQFP TO 48DIP 0.6
Packaging: Bulk
Number of Pins: 48
Mounting Type: Through Hole
Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-351000-10 18036-ssop-to-dip-adapter.pdf
18-351000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Bulk
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-351000-10 18036-ssop-to-dip-adapter.pdf
20-351000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
96-080M80 96-080M80.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 80PGA
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
36-651000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER 36POS SSOP/DIP .6
Packaging: Bulk
Number of Pins: 36
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
52-505-110 505_Series.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 52PGA
Packaging: Bulk
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-9513-10 12011-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-036-206 11012-male-female-dip-jumpers.pdf
Hersteller: Aries Electronics
Description: CABLE DIP MALE/FEMALE 14POS GOLD
Packaging: Bulk
Connector Type: DIP to DIP, Reversed
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 3.00' (914.40mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-600-11 12032-dip-header.pdf
08-600-11
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 8POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 306 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.27 EUR
44+2.67 EUR
132+2.55 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
32-655000-10 18041-tsop-to-dip-adapter.pdf
32-655000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Silver
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
18-350000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.31 EUR
21+33.32 EUR
42+31.73 EUR
63+30.83 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-680-191TC 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 14POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-305984-10 18086-aromat-relay-adapter.pdf
Hersteller: Aries Electronics
Description: ADAPTER FOR TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6810-90T 13002-vertical-display-socket.pdf
18-6810-90T
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.03 EUR
10+22.18 EUR
25+21.33 EUR
50+20.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-6810-90T 13002-vertical-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-823-90C
Hersteller: Aries Electronics
Description: IC SOCKET 14PIN VERT SCKT HORIZ
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
97-68340-P 18025-qfp-to-pga-adapter.pdf
Hersteller: Aries Electronics
Description: ADAPTER/PANEL QFP TO PGA 144POS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
97-AQ132D 18022-pqfp-to-pga-socket.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PQFP TO 132PGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-18 xx-x55x-1-8.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-305263-20 18081-qfp-to-plcc-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 44PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-547-11E 10015-universal-soic-zif-test-socket.pdf
44-547-11E
Hersteller: Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+367.47 EUR
10+340.51 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-823-90CV0
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
07-001-152FB 11001-fusion-bonded-cable-jumpers.pdf
Hersteller: Aries Electronics
Description: CABLE JUMPER 7POS 2.54MM 1"
Packaging: Bulk
Length: 1.000" (25.40mm)
Pitch: 0.100" (2.54mm)
Termination Style: Completely Exposed Wires on Both Sides with Protective Tab
Cable Type: Ribbon
Length - Exposed Ends: 0.125" (3.18mm)
Number of Conductors: 7
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-4513-10 12011-dip-collet-socket.pdf
08-4513-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 1585 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.53 EUR
10+2.15 EUR
25+2.02 EUR
50+1.92 EUR
100+1.83 EUR
250+1.71 EUR
500+1.63 EUR
1000+1.55 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
25-0625-11 12036-pin-line-header.pdf
25-0625-11
Hersteller: Aries Electronics
Description: CONN HDR STRIP FORK 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.39 EUR
10+20.74 EUR
100+18.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-354W00-10 18073-dip-to-sowic-adapter.pdf
Hersteller: Aries Electronics
Description: CONN ADAPTER 14PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-354W00-10 18073-dip-to-sowic-adapter.pdf
Hersteller: Aries Electronics
Description: CONN ADAPTER 16PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-354W00-10 18073-dip-to-sowic-adapter.pdf
Hersteller: Aries Electronics
Description: CONN ADAPTER 20PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-354W00-10 18073-dip-to-sowic-adapter.pdf
Hersteller: Aries Electronics
Description: CONN ADAPTER 24PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
144-PRS12001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
04-600-11 12032-dip-header.pdf
04-600-11
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 4POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
auf Bestellung 1053 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.62 EUR
60+2.13 EUR
120+2.03 EUR
540+1.69 EUR
1020+1.45 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
04-650-10 12033-header-covers.pdf
04-650-10
Hersteller: Aries Electronics
Description: 4PIN HEADER COVER
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 4
Accessory Type: Cap (Cover)
auf Bestellung 524 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.93 EUR
10+4.19 EUR
25+3.93 EUR
50+3.74 EUR
100+3.56 EUR
250+3.34 EUR
500+3.18 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
16-304235-10
Hersteller: Aries Electronics
Description: 16-PIN SOCKET TO PIN ADAPTER
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-304633-18
Hersteller: Aries Electronics
Description: SOCKET ADAPTER 20PLCC TO 16DIP
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
08-350000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Tube
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 781 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.04 EUR
10+14.47 EUR
48+12.95 EUR
96+12.33 EUR
144+11.98 EUR
288+11.41 EUR
528+10.93 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
14-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
14-350000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 439 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.32 EUR
10+24.06 EUR
28+22.38 EUR
56+21.31 EUR
112+20.29 EUR
252+19.17 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-351000-11-RC 351000_Series.pdf
14-351000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
16-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
16-350000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 553 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+34.94 EUR
24+27.92 EUR
48+26.59 EUR
72+25.84 EUR
120+24.92 EUR
264+23.57 EUR
504+22.52 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-351000-11-RC 351000_Series.pdf
16-351000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+47.68 EUR
Im Einkaufswagen  Stück im Wert von  UAH
18-351000-11-RC 351000_Series.pdf
18-351000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Tube
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
18-350000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Tube
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+46.02 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
20-350000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 516 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.85 EUR
19+32.37 EUR
38+30.82 EUR
57+29.95 EUR
114+28.53 EUR
266+26.87 EUR
513+25.66 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-350001-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
20-350001-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-351000-11-RC 351000_Series.pdf
20-351000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.4 EUR
19+35.26 EUR
38+33.58 EUR
57+32.63 EUR
114+31.07 EUR
266+29.27 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-650000-11-RC 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
24-650000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
24-350000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Tube
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.28 EUR
16+35.58 EUR
32+33.88 EUR
64+32.27 EUR
112+31.02 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-650000-11-RC 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
28-650000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+119.49 EUR
17+97.83 EUR
34+93.17 EUR
51+90.54 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-350002-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
28-350002-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: DIP to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-351000-11-RC 351000_Series.pdf
28-351000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 166 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+38.28 EUR
14+31.78 EUR
28+30.26 EUR
56+28.82 EUR
112+27.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-651000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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32-650000-11-RC 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
32-650000-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
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32-450001-11-RC 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
32-450001-11-RC
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
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108-PRS12005-12 10004-pga-zif-test-and-burn-in-socket.pdf
108-PRS12005-12
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+138.46 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-650000-10-P 18011-soic-and-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
42-6554-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Tray
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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56-PRS15057-12
Hersteller: Aries Electronics
Description: ZIF PGA SOCKET 56PIN 15X15
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-675-191T 16004-program-header.pdf
16-675-191T
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Features: Programmable
Packaging: Tube
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.73 EUR
23+2.99 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
24-351000-10 18036-ssop-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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10-2810-90C 13004-vertical-display-socket.pdf
10-2810-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.18 EUR
10+10.35 EUR
25+9.7 EUR
50+9.24 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
18-6810-90TWR 13002-vertical-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
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48-6645-18 18090-qfp-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TQFP TO 48DIP 0.6
Packaging: Bulk
Number of Pins: 48
Mounting Type: Through Hole
Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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