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32-6554-11 32-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+51.25 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-10 40-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
1+34.47 EUR
14+28.62 EUR
28+27.25 EUR
56+25.95 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-11 40-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+68.23 EUR
14+56.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
48-6554-10 48-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 209 Stücke:
Lieferzeit 10-14 Tag (e)
1+39.46 EUR
12+33.11 EUR
30+31.04 EUR
54+29.77 EUR
102+28.46 EUR
Im Einkaufswagen  Stück im Wert von  UAH
48-6554-11 48-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-537-20 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
 Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-823-90 16-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.43 EUR
10+20.18 EUR
25+19.02 EUR
50+18.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-537-20 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-537-20 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SCKT INSERT PLATE FOR PLCC
Part Status: Active
Body Material: Polyphenylene Sulfide (PPS), Glass Filled
Accessory Type: Insert Plate
For Use With/Related Products: PLCC Sockets
Color: Black
Number of Pins: 20
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1109523 1109523 Aries Electronics 18012-dip-to-jedec-to-adapter-socket.pdf Description: SOCKET ADAPTER DIP TO TO-8
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): JEDEC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
1+34.7 EUR
10+29.49 EUR
25+27.64 EUR
50+26.32 EUR
100+25.06 EUR
Im Einkaufswagen  Stück im Wert von  UAH
52-537-20 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
44-537-20 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-C280-10 16-C280-10 Aries Electronics 12024-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Features: Closed Frame
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
auf Bestellung 182 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.09 EUR
10+7.72 EUR
25+7.24 EUR
50+6.89 EUR
100+6.57 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-516-10 28-516-10 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP)
Packaging: Bulk
Mounting Type: Through Hole
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-600-10 24-600-10 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 24POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 24
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.63 EUR
10+6.91 EUR
100+6.09 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-600-10 28-600-10 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 28POS TIN
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 28
Mounting Type: Through Hole
Color: Black
auf Bestellung 370 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.19 EUR
10+7.45 EUR
100+6.56 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
T-90 T-90 Aries Electronics 22003-dip-sizer-and-extractor-tool.pdf Description: IC EXTRACTOR TOOL
Packaging: Bulk
For Use With/Related Products: DIP Sockets
Tool Type: Extraction Tool
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.05 EUR
5+15.78 EUR
10+15.28 EUR
25+14.63 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-537-20 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
 Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
84-653000-10 84-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 84
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-6823-90 24-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-526-10 28-526-10 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.37 EUR
15+18.47 EUR
30+17.59 EUR
60+16.74 EUR
Im Einkaufswagen  Stück im Wert von  UAH
08-3518-10 08-3518-10 Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 725 Stücke:
Lieferzeit 10-14 Tag (e)
10+2.18 EUR
12+1.84 EUR
49+1.64 EUR
98+1.57 EUR
147+1.52 EUR
294+1.45 EUR
539+1.39 EUR
Mindestbestellmenge: 10 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-3518-10 14-3518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
7+3.39 EUR
10+2.58 EUR
28+2.28 EUR
56+2.12 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-3518-10 16-3518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2087 Stücke:
Lieferzeit 10-14 Tag (e)
7+3.14 EUR
24+2.51 EUR
48+2.39 EUR
72+2.32 EUR
120+2.24 EUR
264+2.12 EUR
504+2.02 EUR
1008+1.93 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-3518-10 18-3518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Packaging: Tube
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.92 EUR
22+3.15 EUR
44+3 EUR
66+2.92 EUR
110+2.81 EUR
Mindestbestellmenge: 6 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-3518-10 20-3518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
auf Bestellung 811 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.53 EUR
19+2.88 EUR
38+2.75 EUR
57+2.67 EUR
114+2.53 EUR
266+2.39 EUR
513+2.28 EUR
Mindestbestellmenge: 6 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-3518-10 24-3518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.44 EUR
16+3.87 EUR
112+3.45 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
22-4518-10 22-4518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.49 EUR
10+4.68 EUR
25+4.38 EUR
50+4.18 EUR
100+3.97 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-4518-10 24-4518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 380 Stücke:
Lieferzeit 10-14 Tag (e)
4+6.62 EUR
10+5.62 EUR
25+5.26 EUR
50+5.01 EUR
100+4.77 EUR
250+4.47 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-6518-10 24-6518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
auf Bestellung 134 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.49 EUR
20+3.63 EUR
40+3.45 EUR
60+3.36 EUR
100+3.24 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-6518-10 28-6518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 835 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.24 EUR
17+4.28 EUR
34+4.08 EUR
51+3.97 EUR
102+3.78 EUR
255+3.55 EUR
510+3.37 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
32-6518-10 32-6518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
auf Bestellung 190 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.65 EUR
15+5.15 EUR
30+4.88 EUR
60+4.76 EUR
105+4.53 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-6518-10 40-6518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 506 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.6 EUR
12+8.9 EUR
36+8.23 EUR
60+7.94 EUR
108+7.62 EUR
252+7.18 EUR
504+6.83 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
48-6518-10 48-6518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.57 EUR
10+14.08 EUR
30+13.3 EUR
50+12.98 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
50-9518-10 50-9518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
64-9518-10 64-9518-10 Aries Electronics 518_Series.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-526-10 24-526-10 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.65 EUR
17+19.35 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-0600-21 14-0600-21 Aries Electronics 12034-strip-line-header.pdf Description: CONN HDR DIP POST 14POS GOLD
Number of Rows: 1
Part Status: Active
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Contact Type: Post
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Gold
Connector Type: DIP, DIL - Header
Packaging: Bulk
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.9 EUR
10+5.02 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
T-516AS T-516AS Aries Electronics 22003-dip-sizer-and-extractor-tool.pdf Description: HAND TOOL IC LEG SIZER
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
84-537-20 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1107254-28 1107254-28 Aries Electronics 12030-row-to-row-dip-adapter-socket.pdf Description: SOCKET ADAPTER DIP TO 28DIP 0.3
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
Part Status: Active
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Gold
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.3 EUR
10+25.97 EUR
25+24.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
1107254-24 1107254-24 Aries Electronics 12030-row-to-row-dip-adapter-socket.pdf Description: SOCKET ADAPTER DIP TO 24DIP 0.3
Part Status: Active
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Number of Pins: 24
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 41 Stücke
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1106396-28 1106396-28 Aries Electronics 12030-row-to-row-dip-adapter-socket.pdf Description: SOCKET ADAPTER DIP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.2 EUR
10+25.68 EUR
Im Einkaufswagen  Stück im Wert von  UAH
1106396-24 1106396-24 Aries Electronics 12030-row-to-row-dip-adapter-socket.pdf Description: SOCKET ADAPTER DIP TO 24DIP 0.6
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.39 EUR
10+23.28 EUR
25+21.82 EUR
50+20.78 EUR
100+19.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-C182-10 40-C182-10 Aries Electronics 12024-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.66 EUR
10+19.49 EUR
25+18.36 EUR
50+17.89 EUR
100+17.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-C182-10 32-C182-10 Aries Electronics 12024-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.03 EUR
10+15.33 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-C182-10 28-C182-10 Aries Electronics 12024-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2403 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.41 EUR
10+12.26 EUR
25+11.48 EUR
50+10.94 EUR
100+10.41 EUR
250+9.76 EUR
500+9.29 EUR
1000+8.85 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-C182-10 24-C182-10 Aries Electronics 12024-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.61 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-C280-10 14-C280-10 Aries Electronics 12024-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
 Mindestbestellmenge: 33 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-6823-90 18-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
 Mindestbestellmenge: 11 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-516-11 28-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.55 EUR
13+29.65 EUR
26+28.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-536-11 28-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 28POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 28 (4 x 7)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-536-11 44-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 44POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 44 (4 x 11)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-536-11 68-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 68POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 68 (4 x 17)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-536-11 84-536-11 Aries Electronics Description: CONN SOCKET PLCC ZIF 84POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 84 (4 x 21)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
169-PRS13001-12 169-PRS13001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
1+281.8 EUR
10+239.54 EUR
25+224.56 EUR
50+213.9 EUR
Im Einkaufswagen  Stück im Wert von  UAH
289-PRS17001-12 289-PRS17001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
1+257.5 EUR
10+218.89 EUR
25+205.2 EUR
50+195.42 EUR
Im Einkaufswagen  Stück im Wert von  UAH
361-PRS19001-12 361-PRS19001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+254.8 EUR
10+216.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
441-PRS21001-12 441-PRS21001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+291.04 EUR
10+247.4 EUR
Im Einkaufswagen  Stück im Wert von  UAH
13-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 13POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-6554-11 10001-universal-dip-zif-test-socket.pdf
32-6554-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+51.25 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-10 10001-universal-dip-zif-test-socket.pdf
40-6554-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+34.47 EUR
14+28.62 EUR
28+27.25 EUR
56+25.95 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-11 10001-universal-dip-zif-test-socket.pdf
40-6554-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+68.23 EUR
14+56.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
48-6554-10 10001-universal-dip-zif-test-socket.pdf
48-6554-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 209 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+39.46 EUR
12+33.11 EUR
30+31.04 EUR
54+29.77 EUR
102+28.46 EUR
Im Einkaufswagen  Stück im Wert von  UAH
48-6554-11 10001-universal-dip-zif-test-socket.pdf
48-6554-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-537-20 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-823-90 13001-horizontal-display-socket.pdf
16-823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.43 EUR
10+20.18 EUR
25+19.02 EUR
50+18.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-537-20 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-537-20 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN SCKT INSERT PLATE FOR PLCC
Part Status: Active
Body Material: Polyphenylene Sulfide (PPS), Glass Filled
Accessory Type: Insert Plate
For Use With/Related Products: PLCC Sockets
Color: Black
Number of Pins: 20
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1109523 18012-dip-to-jedec-to-adapter-socket.pdf
1109523
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO TO-8
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): JEDEC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+34.7 EUR
10+29.49 EUR
25+27.64 EUR
50+26.32 EUR
100+25.06 EUR
Im Einkaufswagen  Stück im Wert von  UAH
52-537-20 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
44-537-20 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-C280-10 12024-dip-collet-solder-tail-socket.pdf
16-C280-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Features: Closed Frame
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
auf Bestellung 182 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.09 EUR
10+7.72 EUR
25+7.24 EUR
50+6.89 EUR
100+6.57 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-516-10 516.pdf
28-516-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP)
Packaging: Bulk
Mounting Type: Through Hole
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-600-10 12032-dip-header.pdf
24-600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 24POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 24
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.63 EUR
10+6.91 EUR
100+6.09 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-600-10 12032-dip-header.pdf
28-600-10
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 28POS TIN
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 28
Mounting Type: Through Hole
Color: Black
auf Bestellung 370 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.19 EUR
10+7.45 EUR
100+6.56 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
T-90 22003-dip-sizer-and-extractor-tool.pdf
T-90
Hersteller: Aries Electronics
Description: IC EXTRACTOR TOOL
Packaging: Bulk
For Use With/Related Products: DIP Sockets
Tool Type: Extraction Tool
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.05 EUR
5+15.78 EUR
10+15.28 EUR
25+14.63 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-537-20 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
84-653000-10 18014-plcc-to-dip-adapter.pdf
84-653000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 84
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-6823-90 13001-horizontal-display-socket.pdf
24-6823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-526-10 10018-low-profile-zif-test-socket.pdf
28-526-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.37 EUR
15+18.47 EUR
30+17.59 EUR
60+16.74 EUR
Im Einkaufswagen  Stück im Wert von  UAH
08-3518-10 12016-open-frame-dip-collet-solder-tail-socket.pdf
08-3518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 725 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.18 EUR
12+1.84 EUR
49+1.64 EUR
98+1.57 EUR
147+1.52 EUR
294+1.45 EUR
539+1.39 EUR
Mindestbestellmenge: 10 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-3518-10 518_Series.pdf
14-3518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.39 EUR
10+2.58 EUR
28+2.28 EUR
56+2.12 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-3518-10 518_Series.pdf
16-3518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2087 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.14 EUR
24+2.51 EUR
48+2.39 EUR
72+2.32 EUR
120+2.24 EUR
264+2.12 EUR
504+2.02 EUR
1008+1.93 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-3518-10 518_Series.pdf
18-3518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Packaging: Tube
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.92 EUR
22+3.15 EUR
44+3 EUR
66+2.92 EUR
110+2.81 EUR
Mindestbestellmenge: 6 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-3518-10 518_Series.pdf
20-3518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
auf Bestellung 811 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.53 EUR
19+2.88 EUR
38+2.75 EUR
57+2.67 EUR
114+2.53 EUR
266+2.39 EUR
513+2.28 EUR
Mindestbestellmenge: 6 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-3518-10 518_Series.pdf
24-3518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.44 EUR
16+3.87 EUR
112+3.45 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
22-4518-10 518_Series.pdf
22-4518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.49 EUR
10+4.68 EUR
25+4.38 EUR
50+4.18 EUR
100+3.97 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-4518-10 518_Series.pdf
24-4518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 380 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.62 EUR
10+5.62 EUR
25+5.26 EUR
50+5.01 EUR
100+4.77 EUR
250+4.47 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-6518-10 518_Series.pdf
24-6518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
auf Bestellung 134 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.49 EUR
20+3.63 EUR
40+3.45 EUR
60+3.36 EUR
100+3.24 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-6518-10 518_Series.pdf
28-6518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 835 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.24 EUR
17+4.28 EUR
34+4.08 EUR
51+3.97 EUR
102+3.78 EUR
255+3.55 EUR
510+3.37 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
32-6518-10 518_Series.pdf
32-6518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
auf Bestellung 190 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.65 EUR
15+5.15 EUR
30+4.88 EUR
60+4.76 EUR
105+4.53 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-6518-10 518_Series.pdf
40-6518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 506 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.6 EUR
12+8.9 EUR
36+8.23 EUR
60+7.94 EUR
108+7.62 EUR
252+7.18 EUR
504+6.83 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
48-6518-10 518_Series.pdf
48-6518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.57 EUR
10+14.08 EUR
30+13.3 EUR
50+12.98 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
50-9518-10 518_Series.pdf
50-9518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
64-9518-10 518_Series.pdf
64-9518-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-526-10 10018-low-profile-zif-test-socket.pdf
24-526-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+23.65 EUR
17+19.35 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-0600-21 12034-strip-line-header.pdf
14-0600-21
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 14POS GOLD
Number of Rows: 1
Part Status: Active
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Contact Type: Post
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Gold
Connector Type: DIP, DIL - Header
Packaging: Bulk
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.9 EUR
10+5.02 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
T-516AS 22003-dip-sizer-and-extractor-tool.pdf
T-516AS
Hersteller: Aries Electronics
Description: HAND TOOL IC LEG SIZER
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
84-537-20 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN SCKT INSERT PLATE FOR PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1107254-28 12030-row-to-row-dip-adapter-socket.pdf
1107254-28
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28DIP 0.3
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
Part Status: Active
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Gold
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+29.3 EUR
10+25.97 EUR
25+24.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
1107254-24 12030-row-to-row-dip-adapter-socket.pdf
1107254-24
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 24DIP 0.3
Part Status: Active
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Number of Pins: 24
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 41 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1106396-28 12030-row-to-row-dip-adapter-socket.pdf
1106396-28
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+30.2 EUR
10+25.68 EUR
Im Einkaufswagen  Stück im Wert von  UAH
1106396-24 12030-row-to-row-dip-adapter-socket.pdf
1106396-24
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 24DIP 0.6
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Part Status: Active
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+27.39 EUR
10+23.28 EUR
25+21.82 EUR
50+20.78 EUR
100+19.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-C182-10 12024-dip-collet-solder-tail-socket.pdf
40-C182-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+21.66 EUR
10+19.49 EUR
25+18.36 EUR
50+17.89 EUR
100+17.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
32-C182-10 12024-dip-collet-solder-tail-socket.pdf
32-C182-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.03 EUR
10+15.33 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-C182-10 12024-dip-collet-solder-tail-socket.pdf
28-C182-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2403 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.41 EUR
10+12.26 EUR
25+11.48 EUR
50+10.94 EUR
100+10.41 EUR
250+9.76 EUR
500+9.29 EUR
1000+8.85 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-C182-10 12024-dip-collet-solder-tail-socket.pdf
24-C182-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.61 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-C280-10 12024-dip-collet-solder-tail-socket.pdf
14-C280-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 33 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-6823-90 13001-horizontal-display-socket.pdf
18-6823-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 11 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-516-11 516.pdf
28-516-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+35.55 EUR
13+29.65 EUR
26+28.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-536-11
28-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 28POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 28 (4 x 7)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-536-11
44-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 44POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 44 (4 x 11)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-536-11
68-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 68POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 68 (4 x 17)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-536-11
84-536-11
Hersteller: Aries Electronics
Description: CONN SOCKET PLCC ZIF 84POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 84 (4 x 21)
Type: PLCC, ZIF (ZIP)
Mounting Type: Through Hole
Features: Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
169-PRS13001-12 10004-pga-zif-test-and-burn-in-socket.pdf
169-PRS13001-12
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+281.8 EUR
10+239.54 EUR
25+224.56 EUR
50+213.9 EUR
Im Einkaufswagen  Stück im Wert von  UAH
289-PRS17001-12 10004-pga-zif-test-and-burn-in-socket.pdf
289-PRS17001-12
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+257.5 EUR
10+218.89 EUR
25+205.2 EUR
50+195.42 EUR
Im Einkaufswagen  Stück im Wert von  UAH
361-PRS19001-12 10004-pga-zif-test-and-burn-in-socket.pdf
361-PRS19001-12
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+254.8 EUR
10+216.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
441-PRS21001-12 10004-pga-zif-test-and-burn-in-socket.pdf
441-PRS21001-12
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+291.04 EUR
10+247.4 EUR
Im Einkaufswagen  Stück im Wert von  UAH
13-0513-10 12013-pin-line-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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