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08-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 8POS
Produkt ist nicht verfügbar
10-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
12-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
14-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 14POS
Produkt ist nicht verfügbar
16-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 16POS
Produkt ist nicht verfügbar
18-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 18POS
Produkt ist nicht verfügbar
20-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
22-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
24-655-10 Aries Electronics 16005-program-header-and-cover.pdf Description: CONN COVER HEADER 24POS
Produkt ist nicht verfügbar
T-680 Aries Electronics 22002-programming-tools.pdf Description: HEADER PROGRAMMING TOOL
Produkt ist nicht verfügbar
04-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HDR MALE PIN 4POS TIN
Produkt ist nicht verfügbar
06-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HEADER PROGRAMMABLE 6POS
Produkt ist nicht verfügbar
08-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HDR MALE PIN 8POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
auf Bestellung 1017 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.34 EUR
10+ 1.97 EUR
80+ 1.77 EUR
440+ 1.45 EUR
945+ 1.29 EUR
Mindestbestellmenge: 8
10-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HEADER PROGRAMMABLE 10POS
Produkt ist nicht verfügbar
12-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HEADER PROGRAMMABLE 12POS
Produkt ist nicht verfügbar
14-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HEADER PROGRAMMABLE 14POS
Produkt ist nicht verfügbar
16-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HEADER PROGRAMMABLE 16POS
Produkt ist nicht verfügbar
18-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HEADER PROGRAMMABLE 18POS
Produkt ist nicht verfügbar
20-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HDR MALE PIN 20POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Produkt ist nicht verfügbar
22-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HDR MALE PIN 22POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
24-680-190T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HEADER PROGRAMMABLE 24POS
Produkt ist nicht verfügbar
24-650000-10 24-650000-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 435 Stücke:
Lieferzeit 10-14 Tag (e)
1+45.14 EUR
10+ 39.53 EUR
25+ 37.82 EUR
98+ 35.38 EUR
294+ 33.43 EUR
32-653000-10 32-653000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+74.25 EUR
10+ 68.14 EUR
97-68340 Aries Electronics 18025-qfp-to-pga-adapter.pdf Description: SOCKET ADAPTER QFP TO 144PGA
Produkt ist nicht verfügbar
08-350000-10 08-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 605 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.39 EUR
10+ 15.64 EUR
25+ 14.73 EUR
50+ 14.36 EUR
100+ 13.98 EUR
250+ 12.47 EUR
500+ 11.71 EUR
Mindestbestellmenge: 2
14-350000-10 14-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Bulk
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
16-350000-10 16-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 477 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.44 EUR
24+ 23.43 EUR
120+ 20.43 EUR
20-350000-10 20-350000-10 Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.13 EUR
19+ 25.25 EUR
114+ 20.81 EUR
28-354000-20 Aries Electronics 18009-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
28-351000-10 28-351000-10 Aries Electronics 18036-ssop-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.86 EUR
10+ 34.03 EUR
154+ 30.46 EUR
11-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
28-526-11 28-526-11 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
14-600-11 14-600-11 Aries Electronics 12032-dip-header.pdf Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 241 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.05 EUR
26+ 4.34 EUR
104+ 4.04 EUR
Mindestbestellmenge: 4
16-354000-20 Aries Electronics 18009-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
20-680-191T 20-680-191T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN DIP HEADER 20POS .100
Produkt ist nicht verfügbar
10-2823-90C Aries Electronics DS_43_800_Series.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
10-6810-90TWR Aries Electronics 13002-vertical-display-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
14-680-191T 14-680-191T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 460 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.46 EUR
10+ 2.15 EUR
100+ 1.92 EUR
Mindestbestellmenge: 8
60-1518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 60POS GOLD
Produkt ist nicht verfügbar
1110748 1110748 Aries Electronics 18043-surface-mount-to-dip-jedec-sot-adapter.pdf Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.71 EUR
10+ 22.78 EUR
03-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
06-3518-10T Aries Electronics Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
06-3513-10 06-3513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
6-513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN SOCKET SIP 6POS GOLD
Produkt ist nicht verfügbar
14-35W000-10 Aries Electronics 18007-sowic-to-dip-adapter.pdf Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Produkt ist nicht verfügbar
16-35W000-10 Aries Electronics 18007-sowic-to-dip-adapter.pdf Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Produkt ist nicht verfügbar
18-35W000-10 Aries Electronics 18007-sowic-to-dip-adapter.pdf Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Produkt ist nicht verfügbar
20-35W000-10 Aries Electronics 18007-sowic-to-dip-adapter.pdf Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Produkt ist nicht verfügbar
24-35W000-10 Aries Electronics 18007-sowic-to-dip-adapter.pdf Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Produkt ist nicht verfügbar
28-450001-10 Aries Electronics 18011-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-651000-10 28-651000-10 Aries Electronics 18037-ssop-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
16-680-191T Aries Electronics 16005-program-header-and-cover.pdf Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
95-100I25 Aries Electronics 95-100I25.pdf Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Produkt ist nicht verfügbar
12-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
Produkt ist nicht verfügbar
1109342 Aries Electronics Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-35W000-10 28-35W000-10 Aries Electronics 18007-sowic-to-dip-adapter.pdf Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.33 EUR
14+ 28.02 EUR
12-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 12POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
44-647-10 44-647-10 Aries Electronics 10016-universal-soic-to-dip-adapter.pdf Description: SOCKET UNIV SOIC TO DIP .600
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
14-351000-10 14-351000-10 Aries Electronics 18036-ssop-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Produkt ist nicht verfügbar
16-351000-10 16-351000-10 Aries Electronics 18036-ssop-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.54 EUR
08-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 8POS
Produkt ist nicht verfügbar
10-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
12-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
14-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 14POS
Produkt ist nicht verfügbar
16-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 16POS
Produkt ist nicht verfügbar
18-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 18POS
Produkt ist nicht verfügbar
20-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
22-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
24-655-10 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN COVER HEADER 24POS
Produkt ist nicht verfügbar
T-680 22002-programming-tools.pdf
Hersteller: Aries Electronics
Description: HEADER PROGRAMMING TOOL
Produkt ist nicht verfügbar
04-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 4POS TIN
Produkt ist nicht verfügbar
06-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 6POS
Produkt ist nicht verfügbar
08-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 8POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
auf Bestellung 1017 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.34 EUR
10+ 1.97 EUR
80+ 1.77 EUR
440+ 1.45 EUR
945+ 1.29 EUR
Mindestbestellmenge: 8
10-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 10POS
Produkt ist nicht verfügbar
12-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 12POS
Produkt ist nicht verfügbar
14-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 14POS
Produkt ist nicht verfügbar
16-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 16POS
Produkt ist nicht verfügbar
18-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 18POS
Produkt ist nicht verfügbar
20-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 20POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Produkt ist nicht verfügbar
22-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 22POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
24-680-190T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 24POS
Produkt ist nicht verfügbar
24-650000-10 18011-soic-and-soj-to-dip-adapter.pdf
24-650000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 435 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+45.14 EUR
10+ 39.53 EUR
25+ 37.82 EUR
98+ 35.38 EUR
294+ 33.43 EUR
32-653000-10 18014-plcc-to-dip-adapter.pdf
32-653000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+74.25 EUR
10+ 68.14 EUR
97-68340 18025-qfp-to-pga-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 144PGA
Produkt ist nicht verfügbar
08-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
08-350000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 605 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.39 EUR
10+ 15.64 EUR
25+ 14.73 EUR
50+ 14.36 EUR
100+ 13.98 EUR
250+ 12.47 EUR
500+ 11.71 EUR
Mindestbestellmenge: 2
14-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
14-350000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Bulk
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
16-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
16-350000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 477 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.44 EUR
24+ 23.43 EUR
120+ 20.43 EUR
20-350000-10 18010-soic-and-soj-to-dip-adapter.pdf
20-350000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.13 EUR
19+ 25.25 EUR
114+ 20.81 EUR
28-354000-20 18009-dip-to-soic-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
28-351000-10 18036-ssop-to-dip-adapter.pdf
28-351000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+38.86 EUR
10+ 34.03 EUR
154+ 30.46 EUR
11-0513-10 12013-pin-line-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
28-526-11 10018-low-profile-zif-test-socket.pdf
28-526-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
14-600-11 12032-dip-header.pdf
14-600-11
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 241 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.05 EUR
26+ 4.34 EUR
104+ 4.04 EUR
Mindestbestellmenge: 4
16-354000-20 18009-dip-to-soic-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
20-680-191T 16005-program-header-and-cover.pdf
20-680-191T
Hersteller: Aries Electronics
Description: CONN DIP HEADER 20POS .100
Produkt ist nicht verfügbar
10-2823-90C DS_43_800_Series.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
10-6810-90TWR 13002-vertical-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
14-680-191T 16005-program-header-and-cover.pdf
14-680-191T
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 460 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.46 EUR
10+ 2.15 EUR
100+ 1.92 EUR
Mindestbestellmenge: 8
60-1518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Produkt ist nicht verfügbar
1110748 18043-surface-mount-to-dip-jedec-sot-adapter.pdf
1110748
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.71 EUR
10+ 22.78 EUR
03-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
06-3518-10T
Hersteller: Aries Electronics
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
06-3513-10 12011-dip-collet-socket.pdf
06-3513-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
6-513-10 12011-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Produkt ist nicht verfügbar
14-35W000-10 18007-sowic-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Produkt ist nicht verfügbar
16-35W000-10 18007-sowic-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Produkt ist nicht verfügbar
18-35W000-10 18007-sowic-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Produkt ist nicht verfügbar
20-35W000-10 18007-sowic-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Produkt ist nicht verfügbar
24-35W000-10 18007-sowic-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Produkt ist nicht verfügbar
28-450001-10 18011-soic-and-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-651000-10 18037-ssop-to-dip-adapter.pdf
28-651000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
16-680-191T 16005-program-header-and-cover.pdf
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
95-100I25 95-100I25.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Produkt ist nicht verfügbar
12-0513-10 12013-pin-line-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Produkt ist nicht verfügbar
1109342
Hersteller: Aries Electronics
Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-35W000-10 18007-sowic-to-dip-adapter.pdf
28-35W000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+32.33 EUR
14+ 28.02 EUR
12-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
44-647-10 10016-universal-soic-to-dip-adapter.pdf
44-647-10
Hersteller: Aries Electronics
Description: SOCKET UNIV SOIC TO DIP .600
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
14-351000-10 18036-ssop-to-dip-adapter.pdf
14-351000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Produkt ist nicht verfügbar
16-351000-10 18036-ssop-to-dip-adapter.pdf
16-351000-10
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+43.54 EUR
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