Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15955) > Seite 4 nach 266
Foto | Bezeichnung | Hersteller | Beschreibung |
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08-655-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
10-655-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 10 Accessory Type: Cap (Cover) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
12-655-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 12 Accessory Type: Cap (Cover) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
14-655-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
16-655-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
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18-655-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
20-655-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 20 Accessory Type: Cap (Cover) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
22-655-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 22 Accessory Type: Cap (Cover) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
24-655-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
T-680 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
04-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
06-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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08-680-190T | Aries Electronics |
![]() Packaging: Tray Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Number of Rows: 2 |
auf Bestellung 1016 Stücke: Lieferzeit 10-14 Tag (e) |
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10-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
12-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
14-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
16-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
18-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
20-680-190T | Aries Electronics |
![]() Packaging: Tray Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 20 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
22-680-190T | Aries Electronics |
![]() Packaging: Tray Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 22 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
24-680-190T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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24-650000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 491 Stücke: Lieferzeit 10-14 Tag (e) |
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32-653000-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
auf Bestellung 61 Stücke: Lieferzeit 10-14 Tag (e) |
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97-68340 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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08-350000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
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14-350000-10 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 313 Stücke: Lieferzeit 10-14 Tag (e) |
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16-350000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 156 Stücke: Lieferzeit 10-14 Tag (e) |
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20-350000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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28-354000-20 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 28 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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28-351000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
auf Bestellung 109 Stücke: Lieferzeit 10-14 Tag (e) |
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11-0513-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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28-526-11 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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14-600-11 | Aries Electronics |
![]() Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
auf Bestellung 199 Stücke: Lieferzeit 10-14 Tag (e) |
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16-354000-20 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 16 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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20-680-191T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
10-2823-90C | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
10-6810-90TWR | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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14-680-191T | Aries Electronics |
![]() Features: Programmable Packaging: Bulk Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
auf Bestellung 460 Stücke: Lieferzeit 10-14 Tag (e) |
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60-1518-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
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1110748 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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03-0518-10 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
06-3518-10T | Aries Electronics |
Description: SOCKET W/SOLDER TAIL PINS TIM Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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06-3513-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
6-513-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
14-35W000-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
16-35W000-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
18-35W000-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
20-35W000-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
24-35W000-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
28-450001-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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28-651000-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
16-680-191T | Aries Electronics |
![]() Packaging: Tray Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
95-100I25 | Aries Electronics |
![]() Number of Pins: 100 Mounting Type: Through Hole Convert From (Adapter End): QFP Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
12-0513-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
1109342 | Aries Electronics |
Description: ADAPTER PLCC TO DIP Packaging: Bulk Number of Pins: 44 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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28-35W000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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12-6823-90T | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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44-647-10 | Aries Electronics |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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14-351000-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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16-351000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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08-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 8POS
Description: CONN COVER HEADER 8POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
12-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 14POS
Description: CONN COVER HEADER 14POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 16POS
Description: CONN COVER HEADER 16POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 18POS
Description: CONN COVER HEADER 18POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
22-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
24-655-10 |
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Hersteller: Aries Electronics
Description: CONN COVER HEADER 24POS
Description: CONN COVER HEADER 24POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
T-680 |
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Hersteller: Aries Electronics
Description: HEADER PROGRAMMING TOOL
Description: HEADER PROGRAMMING TOOL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
04-680-190T |
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Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 4POS TIN
Description: CONN HDR MALE PIN 4POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
06-680-190T |
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Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 6POS
Description: CONN HEADER PROGRAMMABLE 6POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
08-680-190T |
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Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 8POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Description: CONN HDR MALE PIN 8POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
auf Bestellung 1016 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
9+ | 2.06 EUR |
11+ | 1.75 EUR |
100+ | 1.49 EUR |
500+ | 1.33 EUR |
1000+ | 1.26 EUR |
10-680-190T |
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Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 10POS
Description: CONN HEADER PROGRAMMABLE 10POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
12-680-190T |
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Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 12POS
Description: CONN HEADER PROGRAMMABLE 12POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-680-190T |
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Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 14POS
Description: CONN HEADER PROGRAMMABLE 14POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-680-190T |
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Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 16POS
Description: CONN HEADER PROGRAMMABLE 16POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-680-190T |
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Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 18POS
Description: CONN HEADER PROGRAMMABLE 18POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-680-190T |
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Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 20POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Description: CONN HDR MALE PIN 20POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
22-680-190T |
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Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 22POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 22POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
24-680-190T |
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Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 24POS
Description: CONN HEADER PROGRAMMABLE 24POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
24-650000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 491 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 43.84 EUR |
10+ | 37.26 EUR |
25+ | 34.93 EUR |
98+ | 31.72 EUR |
196+ | 30.21 EUR |
294+ | 29.36 EUR |
32-653000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 100.23 EUR |
10+ | 77.71 EUR |
25+ | 70.57 EUR |
55+ | 65.13 EUR |
97-68340 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 144PGA
Description: SOCKET ADAPTER QFP TO 144PGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
08-350000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.01 EUR |
10+ | 12.76 EUR |
48+ | 11.42 EUR |
96+ | 10.88 EUR |
144+ | 10.57 EUR |
14-350000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.67 EUR |
10+ | 23.51 EUR |
25+ | 22.04 EUR |
50+ | 20.99 EUR |
100+ | 19.99 EUR |
264+ | 18.67 EUR |
16-350000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.89 EUR |
24+ | 19.88 EUR |
48+ | 18.93 EUR |
72+ | 18.40 EUR |
120+ | 17.75 EUR |
20-350000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 29.20 EUR |
19+ | 22.48 EUR |
38+ | 21.14 EUR |
57+ | 20.39 EUR |
28-354000-20 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-351000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 28.09 EUR |
10+ | 25.61 EUR |
11-0513-10 |
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Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-526-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 31.03 EUR |
15+ | 25.62 EUR |
30+ | 24.40 EUR |
14-600-11 |
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Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 199 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 4.77 EUR |
26+ | 3.79 EUR |
104+ | 3.44 EUR |
16-354000-20 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-680-191T |
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Hersteller: Aries Electronics
Description: CONN DIP HEADER 20POS .100
Description: CONN DIP HEADER 20POS .100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10-2823-90C |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10-6810-90TWR |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-680-191T |
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Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 460 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
8+ | 2.43 EUR |
10+ | 2.12 EUR |
100+ | 1.90 EUR |
60-1518-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1110748 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 23.46 EUR |
10+ | 19.94 EUR |
25+ | 18.69 EUR |
03-0518-10 |
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Hersteller: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 3POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
06-3518-10T |
Hersteller: Aries Electronics
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
06-3513-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
6-513-10 |
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Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-35W000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-35W000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-35W000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-35W000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
24-35W000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-450001-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-651000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-680-191T |
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Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
95-100I25 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
12-0513-10 |
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Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109342 |
Hersteller: Aries Electronics
Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-35W000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.86 EUR |
10+ | 23.68 EUR |
25+ | 22.19 EUR |
50+ | 21.13 EUR |
12-6823-90T |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 12POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
44-647-10 |
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Hersteller: Aries Electronics
Description: SOCKET UNIV SOIC TO DIP .600
Description: SOCKET UNIV SOIC TO DIP .600
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
14-351000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-351000-10 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 47.33 EUR |
24+ | 35.70 EUR |