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40-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
28-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
24-6554-16 24-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
1+79.13 EUR
10+ 72.62 EUR
20-0511-11 Aries Electronics 12008-strip-line-socket.pdf Description: CONN SOCKET SIP 20POS GOLD
Produkt ist nicht verfügbar
24-6570-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-6571-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
66-PRS11054-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
08-350000-10-P Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
12-675-191 Aries Electronics Description: IC SCKT DIP PROG HDR 12 PINS
Produkt ist nicht verfügbar
10-675-191 Aries Electronics Description: HEADER 10 PIN DIP GOLD
Produkt ist nicht verfügbar
ML-100 ML-100 Aries Electronics 16002-miniature-jumper.pdf Description: CONN MINI LINK JUMPER
Packaging: Bulk
Gender: Female Sockets
Contact Finish: Gold
Color: Black
Current Rating (Amps): 3A
Pitch: 0.100" (2.54mm)
Type: Open Top
Height: 0.250" (6.35mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 20.0µin (0.51µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
auf Bestellung 2595 Stücke:
Lieferzeit 10-14 Tag (e)
15+1.18 EUR
18+ 1 EUR
25+ 0.96 EUR
50+ 0.94 EUR
100+ 0.9 EUR
250+ 0.82 EUR
500+ 0.74 EUR
1000+ 0.65 EUR
2500+ 0.59 EUR
Mindestbestellmenge: 15
209-PGM17020-10 209-PGM17020-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.38 EUR
10+ 36.24 EUR
108-PGM12005-10 Aries Electronics 14033-pga-socket-header.pdf Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
10-2513-10 10-2513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
auf Bestellung 343 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.27 EUR
10+ 2.86 EUR
100+ 2.55 EUR
Mindestbestellmenge: 6
21-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 21POS GOLD
Produkt ist nicht verfügbar
64-304121-00 Aries Electronics 64-304121-00.pdf Description: SOCKET ADAPTER TQFP TO 64QFP
Produkt ist nicht verfügbar
14-012-211 Aries Electronics Description: CONN MALE/FEMALE DIP JUMPER ASSY
Packaging: Bulk
Connector Type: DIP to DIP
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Usage: Socket (0.1"), Board In
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Solder
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
Produkt ist nicht verfügbar
16-6625-11 Aries Electronics 12035-dip-header.pdf Description: DIP HEADER 625 SERIES
Produkt ist nicht verfügbar
84-505-110 Aries Electronics 505_Series.pdf Description: SOCKET ADAPTER PLCC TO 84PGA
Produkt ist nicht verfügbar
169-PRS13001-16 Aries Electronics Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
18-6513-10 18-6513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 158 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.25 EUR
10+ 5.67 EUR
25+ 5.37 EUR
50+ 5.24 EUR
100+ 4.99 EUR
Mindestbestellmenge: 3
14-054-108 Aries Electronics Description: 14POS DIP CABLE
Produkt ist nicht verfügbar
07-002-171 Aries Electronics 11005-flat-pin-staked-flex-jumpers.pdf Description: FLAT FLEX CABLE 7 POS 2" 26AWG
Produkt ist nicht verfügbar
24-6553-11 Aries Electronics Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
08-350000-10-HT Aries Electronics 18005-high-temp-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: Polyimide (PI)
Part Status: Active
Produkt ist nicht verfügbar
68-PRS11033-12 Aries Electronics Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
05-0513-10T 05-0513-10T Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2511 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.71 EUR
13+ 1.45 EUR
100+ 1.3 EUR
1000+ 0.95 EUR
Mindestbestellmenge: 11
12-005-152FB Aries Electronics Description: CABLE 12POS .100 JUMPER 5 INCHES
Produkt ist nicht verfügbar
28-3554-10 Aries Electronics Description: 28 PIN ZIF SOCKET TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
40-6501-30 Aries Electronics Description: CONN IC DIP SOCKET 40POS TIN
Produkt ist nicht verfügbar
32-650000-10-P Aries Electronics Description: SOCKET ADAPTER SOIC TO 32DIP 0.6
Produkt ist nicht verfügbar
20-7800-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 20POS TIN
Features: Carrier, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
07-0513-10 07-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf Description: CONN SOCKET SIP 7POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.22 EUR
10+ 1.93 EUR
100+ 1.72 EUR
Mindestbestellmenge: 8
24-3551-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-3552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6551-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6553-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
44-6552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 44POS
Produkt ist nicht verfügbar
24-3551-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
24-3551-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-3552-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
24-3552-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-3553-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
24-3553-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-3553-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6551-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
24-6551-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-6552-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
24-6552-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-6553-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
1109253 Aries Electronics Description: SER X55X UNIV ZIF DIP TST SCKT
Produkt ist nicht verfügbar
1110729-24 Aries Electronics Description: SER X55X UNIV ZIF DIP TST SCKT
Part Status: Active
Produkt ist nicht verfügbar
24-3554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
44-3554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 44POS
Produkt ist nicht verfügbar
24-3554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
24-3554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
7410-101-10 Aries Electronics Description: SER X55X UNIV ZIF DIP TST SCKT
Produkt ist nicht verfügbar
28-3551-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-3552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
40-6554-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
28-6554-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
24-6554-16 10001-universal-dip-zif-test-socket.pdf
24-6554-16
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+79.13 EUR
10+ 72.62 EUR
20-0511-11 12008-strip-line-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 20POS GOLD
Produkt ist nicht verfügbar
24-6570-11 10019-universal-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-6571-11 10019-universal-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
66-PRS11054-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
08-350000-10-P 18010-soic-and-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
12-675-191
Hersteller: Aries Electronics
Description: IC SCKT DIP PROG HDR 12 PINS
Produkt ist nicht verfügbar
10-675-191
Hersteller: Aries Electronics
Description: HEADER 10 PIN DIP GOLD
Produkt ist nicht verfügbar
ML-100 16002-miniature-jumper.pdf
ML-100
Hersteller: Aries Electronics
Description: CONN MINI LINK JUMPER
Packaging: Bulk
Gender: Female Sockets
Contact Finish: Gold
Color: Black
Current Rating (Amps): 3A
Pitch: 0.100" (2.54mm)
Type: Open Top
Height: 0.250" (6.35mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 20.0µin (0.51µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
auf Bestellung 2595 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15+1.18 EUR
18+ 1 EUR
25+ 0.96 EUR
50+ 0.94 EUR
100+ 0.9 EUR
250+ 0.82 EUR
500+ 0.74 EUR
1000+ 0.65 EUR
2500+ 0.59 EUR
Mindestbestellmenge: 15
209-PGM17020-10 14033-pga-socket-header.pdf
209-PGM17020-10
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+41.38 EUR
10+ 36.24 EUR
108-PGM12005-10 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
10-2513-10 12011-dip-collet-socket.pdf
10-2513-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
auf Bestellung 343 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.27 EUR
10+ 2.86 EUR
100+ 2.55 EUR
Mindestbestellmenge: 6
21-0513-10 12013-pin-line-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 21POS GOLD
Produkt ist nicht verfügbar
64-304121-00 64-304121-00.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TQFP TO 64QFP
Produkt ist nicht verfügbar
14-012-211
Hersteller: Aries Electronics
Description: CONN MALE/FEMALE DIP JUMPER ASSY
Packaging: Bulk
Connector Type: DIP to DIP
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Usage: Socket (0.1"), Board In
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Solder
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
Produkt ist nicht verfügbar
16-6625-11 12035-dip-header.pdf
Hersteller: Aries Electronics
Description: DIP HEADER 625 SERIES
Produkt ist nicht verfügbar
84-505-110 505_Series.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84PGA
Produkt ist nicht verfügbar
169-PRS13001-16
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
18-6513-10 12011-dip-collet-socket.pdf
18-6513-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 158 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.25 EUR
10+ 5.67 EUR
25+ 5.37 EUR
50+ 5.24 EUR
100+ 4.99 EUR
Mindestbestellmenge: 3
14-054-108
Hersteller: Aries Electronics
Description: 14POS DIP CABLE
Produkt ist nicht verfügbar
07-002-171 11005-flat-pin-staked-flex-jumpers.pdf
Hersteller: Aries Electronics
Description: FLAT FLEX CABLE 7 POS 2" 26AWG
Produkt ist nicht verfügbar
24-6553-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
08-350000-10-HT 18005-high-temp-soic-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: Polyimide (PI)
Part Status: Active
Produkt ist nicht verfügbar
68-PRS11033-12
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
05-0513-10T 12013-pin-line-collet-socket.pdf
05-0513-10T
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2511 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11+1.71 EUR
13+ 1.45 EUR
100+ 1.3 EUR
1000+ 0.95 EUR
Mindestbestellmenge: 11
12-005-152FB
Hersteller: Aries Electronics
Description: CABLE 12POS .100 JUMPER 5 INCHES
Produkt ist nicht verfügbar
28-3554-10
Hersteller: Aries Electronics
Description: 28 PIN ZIF SOCKET TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
40-6501-30
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Produkt ist nicht verfügbar
32-650000-10-P
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 32DIP 0.6
Produkt ist nicht verfügbar
20-7800-10 12010-strip-line-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Features: Carrier, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
07-0513-10 12013-pin-line-collet-socket.pdf
07-0513-10
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.22 EUR
10+ 1.93 EUR
100+ 1.72 EUR
Mindestbestellmenge: 8
24-3551-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-3552-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6551-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6552-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6553-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
44-6552-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS
Produkt ist nicht verfügbar
24-3551-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
24-3551-11 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-3552-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
24-3552-11 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-3553-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
24-3553-11 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-3553-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
24-6551-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
24-6551-11 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-6552-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
24-6552-11 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
24-6553-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
1109253
Hersteller: Aries Electronics
Description: SER X55X UNIV ZIF DIP TST SCKT
Produkt ist nicht verfügbar
1110729-24
Hersteller: Aries Electronics
Description: SER X55X UNIV ZIF DIP TST SCKT
Part Status: Active
Produkt ist nicht verfügbar
24-3554-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
44-3554-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS
Produkt ist nicht verfügbar
24-3554-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Produkt ist nicht verfügbar
24-3554-11 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Produkt ist nicht verfügbar
7410-101-10
Hersteller: Aries Electronics
Description: SER X55X UNIV ZIF DIP TST SCKT
Produkt ist nicht verfügbar
28-3551-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-3552-16 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
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