Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15955) > Seite 129 nach 266
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
08-354000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 8 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
08-354000-21-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 8 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
14-354000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 14 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
14-354000-21-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 14 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
16-354000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 16 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
16-354000-21-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 16 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
18-354000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 18 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
18-354000-21-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 18 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
20-354000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 20 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
20-354000-21-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 20 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
24-354000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 24 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
24-354000-21-RC | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
28-354000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
28-354000-21-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
![]() |
08-350000-11-RC-P | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
14-350000-11-RC-P | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
16-350000-11-RC-P | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
18-350000-11-RC-P | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
20-350000-11-RC-P | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
28-350002-11-RC-P | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
28-653000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
32-653000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
44-653000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 44 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
68-653000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 68 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
84-653000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 84 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
24-351000-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 24 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
16-307349-11-RC-P (170 UP) | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
16-307349-11-RC | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-308 100 PCS MINIMUM | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-314 | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-316 | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-318 | Aries Electronics |
![]() Packaging: Bulk Features: Spacer Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-320 100 PCS MINIMUM | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-324 | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-328 100 PCS MINIMUM | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-624 100 PCS MINIMUM | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-628 100 PCS MINIMUM | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-632 100 PCS MINIMUM | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
1109681-648 100 PCS MINIMUM | Aries Electronics |
![]() |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
|
LCQT-QFP0.5-32 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.8-32 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.031" (0.80mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.5-40 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 40 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.020" (0.50mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.5-40-1 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 40 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.020" (0.50mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.8-44 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFP Part Status: Active |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-QFP0.5-52 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 52 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.020" (0.50mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.65-52 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 52 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.5-60 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 60 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.020" (0.50mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.5-64 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFP Part Status: Active |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-QFP0.65-64 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.8-64 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.5-80 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 80 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.020" (0.50mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.65-80 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 80 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-QFP0.8-80 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 80 Mounting Type: Through Hole Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Termination: Solder Housing Material: Polyester Pitch - Mating: 0.031" (0.80mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
LCQT-SOT23-6 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.500" W (10.16mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT23 Part Status: Active |
auf Bestellung 1319 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-SOIC8-8 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.500" W (12.70mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 4331 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-MSOP10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.600" L x 0.500" W (15.24mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 635 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-TSSOP14 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
auf Bestellung 4702 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-SOIC14 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 236 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-SOIC14W | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 104 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
LCQT-TSSOP16 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
auf Bestellung 225 Stücke: Lieferzeit 10-14 Tag (e) |
|
08-354000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
08-354000-21-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-354000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-354000-21-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-354000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-354000-21-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-354000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-354000-21-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-354000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-354000-21-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
24-354000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 24SOIC
Packaging: Bulk
Number of Pins: 24
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 24SOIC
Packaging: Bulk
Number of Pins: 24
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
24-354000-21-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 24SOIC
Description: SOCKET ADAPTER DIP TO 24SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-354000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-354000-21-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
08-350000-11-RC-P |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-350000-11-RC-P |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-350000-11-RC-P |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-350000-11-RC-P |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-350000-11-RC-P |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-350002-11-RC-P |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
28-653000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
32-653000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
44-653000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
68-653000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
84-653000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
24-351000-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-307349-11-RC-P (170 UP) |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-307349-11-RC |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-308 100 PCS MINIMUM |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-314 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-316 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-318 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Spacer
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Spacer
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-320 100 PCS MINIMUM |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-324 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-328 100 PCS MINIMUM |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-624 100 PCS MINIMUM |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-628 100 PCS MINIMUM |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-632 100 PCS MINIMUM |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1109681-648 100 PCS MINIMUM |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.5-32 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.8-32 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.5-40 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.5-40-1 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.8-44 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 44QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
Description: SOCKET ADAPTER MULT PKG TO 44QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 25.41 EUR |
10+ | 19.54 EUR |
25+ | 17.67 EUR |
LCQT-QFP0.5-52 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.65-52 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.5-60 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 60QFP
Packaging: Tube
Number of Pins: 60
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER MULT PKG TO 60QFP
Packaging: Tube
Number of Pins: 60
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.5-64 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.36 EUR |
17+ | 15.06 EUR |
34+ | 14.16 EUR |
LCQT-QFP0.65-64 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.8-64 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.5-80 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.65-80 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-QFP0.8-80 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-SOT23-6 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOT-23 TO 6DIP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.500" W (10.16mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT23
Part Status: Active
Description: SOCKET ADAPTER SOT-23 TO 6DIP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.500" W (10.16mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT23
Part Status: Active
auf Bestellung 1319 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 4.38 EUR |
10+ | 3.72 EUR |
25+ | 3.49 EUR |
78+ | 3.22 EUR |
156+ | 3.07 EUR |
312+ | 2.92 EUR |
546+ | 2.81 EUR |
1014+ | 2.69 EUR |
LCQT-SOIC8-8 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP
Packaging: Bulk
Size / Dimension: 0.500" L x 0.500" W (12.70mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 8DIP
Packaging: Bulk
Size / Dimension: 0.500" L x 0.500" W (12.70mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 4331 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 4.45 EUR |
10+ | 3.78 EUR |
25+ | 3.54 EUR |
59+ | 3.34 EUR |
118+ | 3.18 EUR |
295+ | 2.98 EUR |
531+ | 2.86 EUR |
1003+ | 2.73 EUR |
2537+ | 2.56 EUR |
LCQT-MSOP10 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER MSOP TO 10DIP
Packaging: Bulk
Size / Dimension: 0.600" L x 0.500" W (15.24mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: SOCKET ADAPTER MSOP TO 10DIP
Packaging: Bulk
Size / Dimension: 0.600" L x 0.500" W (15.24mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 635 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 4.89 EUR |
10+ | 4.15 EUR |
48+ | 3.71 EUR |
96+ | 3.53 EUR |
144+ | 3.44 EUR |
288+ | 3.27 EUR |
528+ | 3.13 EUR |
LCQT-TSSOP14 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: SOCKET ADAPTER TSSOP TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 4702 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 4.70 EUR |
10+ | 3.98 EUR |
34+ | 3.66 EUR |
68+ | 3.48 EUR |
102+ | 3.38 EUR |
272+ | 3.16 EUR |
510+ | 3.13 EUR |
LCQT-SOIC14 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 236 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.41 EUR |
10+ | 5.45 EUR |
34+ | 5.00 EUR |
68+ | 4.76 EUR |
102+ | 4.62 EUR |
LCQT-SOIC14W |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC-W TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.41 EUR |
10+ | 5.45 EUR |
34+ | 5.00 EUR |
68+ | 4.76 EUR |
102+ | 4.62 EUR |
LCQT-TSSOP16 |
![]() |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: SOCKET ADAPTER TSSOP TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.02 EUR |
10+ | 5.98 EUR |
30+ | 5.53 EUR |
60+ | 5.27 EUR |
120+ | 5.02 EUR |